- 英文简称:amkor
- 英文全称:Amkor Technology,Inc.
- 公司官网:https://www.amkor.com/
amkor
中文资料: 48条
amkor应用领域
amkor公司简介
AmkorTechnology,Inc.是全球最大的外包半导体封装和测试服务提供商之一。Amkor成立于1968年,率先开展IC封装和测试外包业务,现在是全球250多家领先半导体公司,代工厂和电子OEM的战略制造合作伙伴。Amkor的运营基地包括1000万平方英尺的建筑面积,生产设施,产品开发中心以及位于亚洲,欧洲和美国主要电子制造地区的销售和支持办事处。
amkor主营产品
Leading the Industry in Outsourcing Semiconductor Assembly and Test
Digital cameras. Cell phones. Network servers. Laptops. Video games. MP3 players.
When Amkor Technology was founded in 1968, many of the products that we take for
granted today existed only in the minds eye of visionaries.
Amkor helped make these visions a reality by pioneering the outsourcing of
semiconductor assembly and test services. Today, Amkor is a strategic contract
manufacturing resource for many of the worlds leading semiconductor companies. We have
developed unique expertise in high-volume manufacturing techniques and have diversified
and expanded our operational scope by establishing production centers in strategic
locations throughout Asia.
Amkor provides leading-edge package solutions such as Stacked Packaging, Flip Chip,
MicroLeadFrame®, System-in-Package, MEMS, Wafer Level Packaging (WLP), CMOS Image
Sensor Camera Modules, and Game, Memory and I/O Cards (AmkKard®) for latest generation
applications.
Amkor supplements its world-class operational scope with the industrys
Largest package design staff
Broadest portfolio of packaging technology
Deepest sales and support organization
As integrated circuits increase in speed and complexity, the right semiconductor
packaging becomes critical to ensure optimal system performance. Amkor is an industry
leader in tailoring application-specific package design, assembly and test solutions.
Amkor offers the industrys broadest array of package formats and sizes, from
traditional, "off-the-shelf" leadframe configurations to leading-edge chip scale, flip
chip and system-in-package solutions incorporating highly customized designs. This
allows Amkor to be a single source for many of our customers total IC packaging
requirements.
We also provide a complete range of test engineering services for RF, mixed signal,
logic and memory devices, from test program development to full product
characterization. Amkor is a major provider of RF test services and is the world leader
in Strip Test, an innovative, highly parallel test solution that offers customers low
cost, faster index time and improved test yields.
Collaboration: Speeding Time-to-Revenue
With Amkor providing turnkey solutions that include semiconductor design, packaging,
test and drop-shipment services, our customers can get accelerate time-to-revenue for
their new products.
Amkor collaborates with customers and leading OEMs to develop comprehensive package
solutions that make it easier for next-generation semiconductors to be designed into
next-generation end products. By sharing device, package and product roadmaps we enable
our customers - and their customers - to accelerate the development and deployment of
new microelectronic applications.
Focusing on our core competencies allows our customers to optimize their assets and
reduce time-to-sales.
The Industrys Broadest Reach
Amkor has more than five million square feet of manufacturing space in factories
strategically located in key microelectronic manufacturing centers throughout Asia. Our
customers benefit from the industrys most extensive operational footprint, which
enables us to easily handle large orders and quick turnaround times. All manufacturing
sites worldwide are working towards, or have received certification to QS-9000, ISO-
9001, ISO-9002, ISO-14001, ISO-14000, IECQ, and DSCC / QML.
Amkor factories are strategically located in the heart of Asias microelectronic
manufacturing centers
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