FEATURES

Package height down to 0.6 mm

Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices

Established package infrastructure with standard CABGA and fcCSP footprints

Consistent product performance with high yields and reliability

Die overhang wirebonding

Low loop wirebonding to 40 μm or less

Pb-free, RoHS compliant and green materials

Passive component integration options

JEDEC standard outlines including MO-192, MO-195, MO-216, MO-219 and MO-298

Applications

FlipStack® CSP technology enables smaller, lighter and more innovative new product form factors at a lower cost. This solution address es a range of design requirements, and enables a wide variety of applications, including portable multimedia devices such as tablets, cell phones and digital cameras.