FEATURES

10 x 10 mm to 32 x 32 mm body size

44-240 lead counts

Custom leadframe design available

Die up and down configurations

High conductivity copper leadframes

JEDEC standard compliant package outlines

Integrated thermal enhancement available with heat spreader

Fine pitch wirebond capability

Pb-free material sets

APPLICATIONS

Amkor’s MQFP line is adapted to meet the increasing challenges of advanced Digital Signal Processors (DSP), microcontrollers, ASIC, gate arrays (FPGA/PLD), and other technologies. These packages fill application needs in commercial, office, industrial and other product areas.