FEATURES

Polymer dielectrics

Multi-die and large die capability

Large body package capability

High-density interconnects

Miniaturization

Cost efficiency

Thermal management

Integration flexibility

APPLICATIONS

High Performance Computing (HPC)

Heterogeneous integrarion

Functional chip integration (CPU/GPU)

System-on-Chip (SoC) partitioning

Multi-die configurations

3D PoP-compatible applications

High-performance mobile application processors and baseband devices