FEATURES

Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction

Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities

Lowest cost using Amkor standard CABGA bill of materials selection

1.5-27 mm body size available

Square or rectangle packages available

4-700 ball/lead counts

0.4, 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available

JEDEC publication 95 design guide 4.5 (JEP95)

RoHS-6 (green) BOM options for 100% of CABGA family

Thermal conductivity epoxy (8 W/mk) and thermal conductivity compound (3 W/mK) are available

Applications

The ChipArray® package family is applicable for a wide range of semiconductors from high end FPGAs, ASICS to memory, analog, RF devices, MCUs and simple PLDs requiring a package size smaller than conv entional PBGAs or leadframe packages. ChipArray® packages fill the need for the low cost, minimum space, high performance and reliability requirements of mobile and gaming devices, notebooks, personal computers, networking, automotive and industrial applications.