FEATURES

Cu wire interconnect for low cost

Standard JEDEC package outlines

Multi-die production capability

Turnkey test services, including strip test options

ExposedPad configuration for increased thermal efficiency

Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)

Green materials are standard – Pb-free and RoHS compliant

Stealth dicing (narrow saw streets)

Larger/Higher density leadframe strips

Leadframe roughening for improved MSL capability