FEATURES

10-16 mm body sizes (common); custom body sizes available on request

Top package I/O interface flexible for various top connections (die, passives, etc.)

Wafer thinning/handling <100 μm is available

Mature Package-on-Package (PoP) platform with consistent product performance and reliability

Package technology is well established in high volume production

Stacked package heights from 0.55 mm available in a variety of configurations (see stack-up table)

Applications

Interposer PoP packages are designed for products requiring efficient memory architectures including multiple buses and increased memory density and performance, while reducing mounted area. Portable electronic products such as mobile phones, portable media players (audio/graphics processor plus memory), gaming and other mobile applications can benefit from the combination of stacked package and small footprint.