FEATURES

Low resistance/inductance packaging

Reduced form factor, Chip Scale Package (CSP)

CMOS, GaN and SiC compatible

Integrated power building block

Reduced thermal and electrical interfaces

Direct connection of the source or drain to the PCB

High percent of conductive material within the volume of the package of 30-70%

Low resistance (Rds), low inductance (Lds) and good capacitive (Ciss) performance compared to other discrete packages

Custom and standard pin layouts in a dual-sided power package

Applications

PowerCSP™ is suitable for power applications designed for low on-resistance and high-speed-switching MOSFETs such as:

Telecom/Data centers

Electric and hybrid electric vehicles

DC/DC conversion