Low Profile Quad Flat Pack (LQFP) Packages:

Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

Features:

Amkor’s LQFP packaging portfolio provides:

• 7 x 7 mm to 28 x 28 mm body size

• 32 to 256 lead counts

• Copper leadframes • Broad selection of die pad sizes

• Custom leadframe design available

• 1.4 mm body thickness

• Low stress die attach adhesive

• Rapid cure mold compound

• Power enhancement version - PowerQuad

Applications:

Amkor’s LQFPs are an ideal IC package for most IC semiconductor technologies such as ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets.