IRFR价格
参考价格:¥3.8129
型号:IRFR010PBF 品牌:Vishay 备注:这里有IRFR多少钱,2026年最近7天走势,今日出价,今日竞价,IRFR批发/采购报价,IRFR行情走势销售排行榜,IRFR报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
IRFR | Power MOSFET(Vdss=100V, Rds(on)=0.21ohm, Id=9.4A) Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, p | IRF | ||
IRFR | Ultra Low On-Resistance Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, p | KERSEMI | ||
IRFR | Surface Mount (IRFR120N) 文件:3.73792 Mbytes Page:10 Pages | KERSEMI | ||
IRFR | Power MOSFET(Vdss=100V, Rds(on)=0.21ohm, Id=9.4A) | INFINEON 英飞凌 | ||
丝印代码:IRFR024;N-Channel Enhancement Mode MOSFET Description The IRFR024NT uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 4.5V. This device is suitable for use as a Battery protection or in other Switching application. General Features VDS = 60V ID =30 A RDS(ON) | EVVOSEMI 翊欧 | |||
丝印代码:IRFR5305;-60 V P-Channel Enhancement Mode MOSFET DESCRIPTION The uses advancedtrench technology to provide excellentRDS(ON) and low gate charge .Thisdevice issuitable for use as a loadswitch or inPWM applications. GENERAL FEATURES VDS =- 60V,ID =-30A RDS(ON) | EVVOSEMI 翊欧 | |||
丝印代码:IRFR5305;-60 V P - Channel Enhancement Mode MOSFET GENERAL FEATURES VDS =- 60V,ID =-30A RDS(ON) | UMW 友台半导体 | |||
丝印代码:IRFR5505;-60V P -Channel Enhancement Mode MOSFET General Features VDS = -60V ID =-10 A RDS(ON) | UMW 友台半导体 | |||
丝印代码:IRFR5505;-60V P -Channel Enhancement Mode MOSFET Description The uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 4.5V. This device is suitable for use as a Battery protection or in other Switching application. General Features VDS = -60V ID =-10 A RDS(ON) | EVVOSEMI 翊欧 | |||
丝印代码:IRFR9024;60V P-Channel Enhancement Mode MOSFET General Features Vos = -60V Ip =-20 A Ros(on) | EVVOSEMI 翊欧 | |||
丝印代码:IRFR9024;-60V P -Channel Enhancement Mode MOSFET General Features Vps =-60V Ip=-20A Robson) | UMW 友台半导体 | |||
丝印代码:IRFR9120N;-100V P-Channel Enhancement Mode MOSFET General Features VDS=-100V,ID=-8A RDS(ON) | EVVOSEMI 翊欧 | |||
丝印代码:IRFR9120;-100V P-Channel Enhancement Mode MOSFET General Features Vbs =-100V,Ip =-8A Rosin) | UMW 友台半导体 | |||
Advanced Process Technology Description Specifically designed for Automotive applications, this MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetiti | KERSEMI | |||
Advanced Power MOSFET FEATURES ■ Avalanche Rugged Technology ■ Rugged Gate Oxide Technology ■ Lower Input Capacitance ■ Improved Gate Charge ■ Extended Safe Operating Area ■ Lower Leakage Current : 10 A (Max.) @ VDS= 200V ■ Low RDS(ON) : 0.626 Ω (Typ.) | FAIRCHILD 仙童半导体 | |||
Surface Mount (IRFR2405) Description The D-Pak is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications. ● Surf | KERSEMI | |||
HEXFET Power MOSFET Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provide | KERSEMI | |||
HEXFET Power MOSFET Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provide | KERSEMI | |||
High Frequency Synchronous Buck Converters for Computer Processor Power Benefits ● Very Low RDS(on) at 4.5V VGS ● Ultra-Low Gate Impedance ● Fully Characterized Avalanche Voltage and Current Applications ● High Frequency Synchronous Buck Converters for Computer Processor Power ● High Frequency Isolated DC-DC Converters with Synchronous Rectification | KERSEMI | |||
Power MOSFET DESCRIPTION The Power MOSFET technology is the key to Vishay’s advanced line of Power MOSFET transistors. The efficient geometry and unique processing of this latest “State of the Art” design achieves: very low on-state resistance combined with high transconductance; superior reverse energy and d | KERSEMI | |||
Power MOSFET Low drive current\nSurface-mount\nFast switching; | VISHAYVishay Siliconix 威世威世科技公司 | |||
N-CHANNEL POWER MOSFET
| SAMSUNG 三星 | |||
Power MOSFET DESCRIPTION The Power MOSFET technology is the key to Vishay’s advanced line of Power MOSFET transistors. The efficient geometry and unique processing of this latest “State of the Art” design achieves: very low on-state resistance combined with high transconductance; superior reverse energy and d | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET FEATURES • Low drive current • Surface-mount • Fast switching • Ease of paralleling • Excellent temperature stability • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION The power MOSFET technology is the key to Vishay’s advanced lin | VISHAYVishay Siliconix 威世威世科技公司 | |||
AVALANCHE AND dv/dt RATED
| IRF | |||
Power MOSFET FEATURES • Low drive current • Surface-mount • Fast switching • Ease of paralleling • Excellent temperature stability • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION The power MOSFET technology is the key to Vishay’s advanced lin | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION The Power MOSFET technology is the key to Vishay’s advanced line of Power MOSFET transistors. The efficient geometry and unique processing of this latest “State of the Art” design achieves: very low on-state resistance combined with high transconductance; superior reverse energy and d | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION The Power MOSFET technology is the key to Vishay’s advanced line of Power MOSFET transistors. The efficient geometry and unique processing of this latest “State of the Art” design achieves: very low on-state resistance combined with high transconductance; superior reverse energy and d | KERSEMI | |||
AVALANCHE AND dv/dt RATED
| IRF | |||
Power MOSFET(Vdss = 60 V, Rds(on) = 0.20 Ohm, Id= 7.7A) Description Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D-Pak is designed for surface mounting using vapor phase, infrared, or wave soldering techni | IRF | |||
Power MOSFET FEATURES • Dynamic dV/dt rating • Surface-mount (IRFR014, SiHFR014) • Straight lead (IRFU014, SiHFU014) • Available in tape and reel • Fast switching • Ease of paralleling • Simple drive requirements • Material categorization: for definitions of compliance please see www.vishay.com/doc?99 | VISHAYVishay Siliconix 威世威世科技公司 | |||
N-CHANNEL POWER MOSFET
| SAMSUNG 三星 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | KERSEMI | |||
Power MOSFET FEATURES • Dynamic dV/dt rating • Surface-mount (IRFR014, SiHFR014) • Straight lead (IRFU014, SiHFU014) • Available in tape and reel • Fast switching • Ease of paralleling • Simple drive requirements • Material categorization: for definitions of compliance please see www.vishay.com/doc?99 | VISHAYVishay Siliconix 威世威世科技公司 | |||
ADVANCED POWER MOSFET FEATURES ♦ Avalanche Rugged Technology ♦ Rugged Gate Oxide Technology ♦ Lower Input Capacitance ♦ Improved Gate Charge ♦ Extended Safe Operating Area ♦ Lower Leakage Current: 10µA (Max.) @ VDS = 60V ♦ Lower RDS(ON): 0.097Ω (Typ.) | FAIRCHILD 仙童半导体 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | VISHAYVishay Siliconix 威世威世科技公司 | |||
HEXFET Power MOSFET Description Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D-Pak is designed for surface mounting using vapor phase, infrared, or wave soldering techni | IRF | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. FEATU | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. FEATU | VISHAYVishay Siliconix 威世威世科技公司 | |||
HEXFETR Power MOSFET DESCRIPTION Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniq | IRF | |||
Power MOSFET FEATURES • Dynamic dV/dt rating • Surface-mount (IRFR020, SiHFR020) • Available in tape and reel • Fast switching • Ease of paralleling • Simple drive requirements • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION Third generation | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET FEATURES • Dynamic dV/dt rating • Surface-mount (IRFR020, SiHFR020) • Available in tape and reel • Fast switching • Ease of paralleling • Simple drive requirements • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION Third generation | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. FEATU | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. FEATU | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. FEATU | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. FEATU | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. FEATU | VISHAYVishay Siliconix 威世威世科技公司 | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. FEATU | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | KERSEMI | |||
Power MOSFET DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Th | VISHAYVishay Siliconix 威世威世科技公司 |
IRFR产品属性
- 类型
描述
- OPN:
IRFR024NTRLPBF/IRFR024NTRPBF
- Qualification:
Non-Automotive
- Package name:
DPAK/DPAK
- VDS max:
55 V
- RDS (on) @10V max:
75 mΩ/75 mΩ
- ID @25°C max:
17 A/17 A
- QG typ @10V:
13.3 nC/13.3 nC
- Polarity:
N
- VGS(th) min:
2 V/2 V
- VGS(th) max:
4 V/4 V
- VGS(th):
3 V/3 V
- Technology:
IR MOSFET™/IR MOSFET™
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
IR |
25+ |
TO-252 |
100 |
公司原装现货 |
|||
INFINEON |
21+ |
TO-252 |
8000 |
绝对原装INFINEON正品现货,12年信誉保证只做原装、一定有货! |
|||
IR |
26+ |
TO-251/TO-25 |
9896 |
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订 |
|||
IR |
23+ |
SOT-252 |
8000 |
只做原装现货 |
|||
IR |
23+ |
SOT-252 |
7000 |
||||
INFINEON |
23+ |
TO-252 |
10000 |
全新、原装 |
|||
IR |
22+ |
SOT-252 |
6000 |
终端可免费供样,支持BOM配单 |
|||
IR |
13+ |
TO-252 |
100000 |
深圳市勤思达科技有限公司主营IR系列全新原装正品,公司现货供应IRFR110TRPBF,绝对正品,欢迎咨询洽谈。 |
|||
Infineon |
25+ |
TO-252AA |
16000 |
原装 |
|||
IR |
SOT252 |
1800 |
现货当天发货 |
IRFR芯片相关品牌
IRFR规格书下载地址
IRFR参数引脚图相关
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- IRFR110TRPBF-CUTTAPE
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- IRFR024TRPBF-CUTTAPE
- IRFR024TRPBF
- IRFR024PBF
- IRFR024NTRPBF-CUTTAPE
- IRFR024NTRPBF
- IRFR024NTRLPBF
- IRFR024NPBF
- IRFR024
- IRFR020TRPBF
- IRFR020PBF
- IRFR020
- IRFR014TRPBF
- IRFR014PBF
- IRFR014
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- IRFQ110
- IRFPS43N50KPBF
- IRFPS40N60KPBF
- IRFPS40N50LPBF
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- IRFPS3810PBF
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- IRFPG50PBF
- IRFPG50
- IRFPG40PBF
- IRFPG40
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- IRFPG30
- IRFPF50PBF
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- IRFPE40PBF
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- IRFPE30
- IRFPC60PBF
- IRFPC60LCPBF
- IRFPC60
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- IRFPC50APBF
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- IRFPC48
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- IRFPC30
- IRFP470
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- IRFP460
- IRFP453
- IRFP452
IRFR数据表相关新闻
IRFR15N20DTRPBF
表面贴装型 N 通道 200 V 17A(Tc) 3W(Ta),140W(Tc) D-PAK(TO-252AA)
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IRFP4668PBF
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联系人张生 电话19926428992 QQ1924037095
2021-10-12IRFR13N20DTRPBF
属性 参数值 商品目录 场效应管(MOSFET) 漏源电压(Vdss) 200V 连续漏极电流(Id) 13A 功率(Pd) 110W 导通电阻(RDS(on)@Vgs,Id) 235mΩ 10V,8A 阈值电压(Vgs(th)@Id) 5.5V 250μA 类型 N沟道
2021-10-12IRFP460PBF
IRFP460PBF
2021-5-20IRFP460PBF 原装正品 现货供应
IRFP460PBF 原装现货供应 0755-28892389 13713856319 QQ:2639752116
2021-3-12
DdatasheetPDF页码索引
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