Description

Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The D-Pak is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 Watts are possible in typical surface mount applications.

● Dynamic dV/dt Rating

● Surface Mount (IRFR014)

● Straight Lead (IRFU014)

● Available in Tape and Reel

● Fast Switching

● Ease of Paralleling

● Simple Drive Requirements

● Lead-Free