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CC13价格
参考价格：￥5.5002
型号：CC13052_ZOWIE-MINI 品牌：Ledil 备注：这里有CC13多少钱，2026年最近7天走势，今日出价，今日竞价，CC13批发/采购报价，CC13行情走势销售排行榜，CC13报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 |   | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F128；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F32；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1310F64；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | | ||
丝印代码：CC1312P；CC1312PSIP SimpleLink™ Sub-1-GHz Wireless System-in-Package 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Programmable radio includes sup | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1312R1F3；CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | | ||
丝印代码：CC1314R106；CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | | ||
丝印代码：CC1314R106；CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | | ||
丝印代码：CC1350F128；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | |
CC13产品属性
- 类型
描述
- 型号
CC13
- 制造商
Carlo Gavazzi
- 功能描述
4P CONT S 200VACDC 2NO2NC
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI |
25+ |
QFM-48(7x7) |
18746 |
样件支持,可原厂排单订货! |
|||
TI |
25+ |
QFM-48(7x7) |
18798 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
TI |
23+ |
N/A |
25000 |
只做原装,可直接咨询 |
|||
TI/德州仪器 |
22+ |
QFN |
100000 |
代理渠道/只做原装/可含税 |
|||
TI 主营CC系列 |
21+ |
VQFN48 |
6894 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
Texas Instruments |
24+ |
VQFN-48 |
3265 |
全新原厂原装，进口正品现货，正规渠道可含税！！ |
|||
Texas Instruments |
20+ |
VQFN-48 |
29860 |
TI微控制器MCU-可开原型号增税票 |
|||
TI(德州仪器) |
24+/25+ |
10000 |
原装正品现货库存价优 |
||||
NA |
23+ |
NA |
26094 |
10年以上分销经验原装进口正品,做服务型企业 |
|||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源！ |
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CC13规格书下载地址
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DdatasheetPDF页码索引
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