型号 功能描述 生产厂家 企业 LOGO 操作
CC1310F128RHBT

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310F128RHBT

封装/外壳:32-VFQFN 裸露焊盘 包装:托盘 描述:IC RF TXRX+MCU ISM\u003c1GHZ 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC1310F128RHBT

SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

更新时间:2025-11-18 8:22:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
23+
32-VFQFN
22500
TI现货商!原装正品!
TI/原
23+
VQFN-32
20000
TI(德州仪器)
2021/2022+
N/A
6000
原厂原装现货订货价格优势终端BOM表可配单提供样品
TI
21+
标准封装
3803
进口原装,订货渠道!
TI(德州仪器)
24+
VQFN-32
7283
原厂可订货,技术支持,直接渠道。可签保供合同
TI/德州仪器
25+
VQFN32
32360
TI/德州仪器全新特价CC1310F128RHBT即刻询购立享优惠#长期有货
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
TI
23+
NA
3000
专业电子元器件供应链正迈科技特价代理特价,原装元器件供应,支持开发样品
TI(德州仪器)
24+
N/A
6000
原厂原装,价格优势,欢迎洽谈!

CC1310F128RHBT数据表相关新闻