型号 功能描述 生产厂家 企业 LOGO 操作
CC1310F32RHBT

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310F32RHBT

丝印代码:CC1310F32;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

CC1310F32RHBT

封装/外壳:32-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU 802.15.4 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

丝印代码:CC1310F32;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

更新时间:2026-3-13 8:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
23+
VQFN32
5000
全新原装,支持实单,非诚勿扰
TI
23+
32-VFQFN
22500
TI现货商!原装正品!
TI
23+
NA
20000
TI
25+
N/A
20948
样件支持,可原厂排单订货!
TI(德州仪器)
25+
QFN32EP(5x5)
1652
原装现货,免费供样,技术支持,原厂对接
TI
21+
标准封装
3840
进口原装,订货渠道!
TI
1731+
VQFN32
1250
一级代理,专注军工、汽车、医疗、工业、新能源、电力
Texas Instruments
20+
VQFN-32
29860
TI微控制器MCU-可开原型号增税票
TI
22+
5000
只做原装鄙视假货15118075546
TI
24+
QFN
17900
一级授权代理原装现货热卖

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