XC3S价格

参考价格:¥433.0313

型号:XC3S1000-4FG320C 品牌:Xilinx 备注:这里有XC3S多少钱,2025年最近7天走势,今日出价,今日竞价,XC3S批发/采购报价,XC3S行情走势销售排行榜,XC3S报价。
型号 功能描述 生产厂家 企业 LOGO 操作

Spartan-3A FPGA Family: Data Sheet

Module 1: Introduction and Ordering Information DS529-1 (v2.0) August 19, 2010 • Introduction • Features • Architectural and Configuration Overview • General I/O Capabilities • Production Status • Supported Packages and Package Marking • Ordering Information Module 2: Spartan-3A FPGA

AMD

超威半导体

Spartan-3AN FPGA Family Data Sheet

Module 1: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 • Introduction • Features • Architectural Overview • Configuration Overview • In-system Flash Memory Overview • General I/O Capabilities • Supported Packages and Package Marking • Ordering Information Module 2:

AMD

超威半导体

Spartan-3A FPGA Family: Data Sheet

Module 1: Introduction and Ordering Information DS529-1 (v2.0) August 19, 2010 • Introduction • Features • Architectural and Configuration Overview • General I/O Capabilities • Production Status • Supported Packages and Package Marking • Ordering Information Module 2: Spartan-3A FPGA

AMD

超威半导体

Spartan-3A FPGA Family: Data Sheet

Module 1: Introduction and Ordering Information DS529-1 (v2.0) August 19, 2010 • Introduction • Features • Architectural and Configuration Overview • General I/O Capabilities • Production Status • Supported Packages and Package Marking • Ordering Information Module 2: Spartan-3A FPGA

AMD

超威半导体

Spartan-3AN FPGA Family Data Sheet

Module 1: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 • Introduction • Features • Architectural Overview • Configuration Overview • In-system Flash Memory Overview • General I/O Capabilities • Supported Packages and Package Marking • Ordering Information Module 2:

AMD

超威半导体

Spartan-3AN FPGA Family Data Sheet

Module 1: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 • Introduction • Features • Architectural Overview • Configuration Overview • In-system Flash Memory Overview • General I/O Capabilities • Supported Packages and Package Marking • Ordering Information Module 2:

AMD

超威半导体

Spartan-3A FPGA Family: Data Sheet

Module 1: Introduction and Ordering Information DS529-1 (v2.0) August 19, 2010 • Introduction • Features • Architectural and Configuration Overview • General I/O Capabilities • Production Status • Supported Packages and Package Marking • Ordering Information Module 2: Spartan-3A FPGA

AMD

超威半导体

Spartan-3AN FPGA Family Data Sheet

Module 1: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 • Introduction • Features • Architectural Overview • Configuration Overview • In-system Flash Memory Overview • General I/O Capabilities • Supported Packages and Package Marking • Ordering Information Module 2:

AMD

超威半导体

Spartan-3A FPGA Family: Data Sheet

Module 1: Introduction and Ordering Information DS529-1 (v2.0) August 19, 2010 • Introduction • Features • Architectural and Configuration Overview • General I/O Capabilities • Production Status • Supported Packages and Package Marking • Ordering Information Module 2: Spartan-3A FPGA

AMD

超威半导体

Spartan-3AN FPGA Family Data Sheet

Module 1: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 • Introduction • Features • Architectural Overview • Configuration Overview • In-system Flash Memory Overview • General I/O Capabilities • Supported Packages and Package Marking • Ordering Information Module 2:

AMD

超威半导体

Spartan-3A FPGA Family: Data Sheet

Module 1: Introduction and Ordering Information DS529-1 (v2.0) August 19, 2010 • Introduction • Features • Architectural and Configuration Overview • General I/O Capabilities • Production Status • Supported Packages and Package Marking • Ordering Information Module 2: Spartan-3A FPGA

AMD

超威半导体

Spartan-3AN FPGA Family Data Sheet

Module 1: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 • Introduction • Features • Architectural Overview • Configuration Overview • In-system Flash Memory Overview • General I/O Capabilities • Supported Packages and Package Marking • Ordering Information Module 2:

AMD

超威半导体

封装/外壳:320-BGA 包装:托盘 描述:IC FPGA 221 I/O 320FBGA 集成电路(IC) FPGA(现场可编程门阵列)

Xilinx

赛灵思

封装/外壳:456-BBGA 包装:托盘 描述:IC FPGA 333 I/O 456FBGA 集成电路(IC) FPGA(现场可编程门阵列)

Xilinx

赛灵思

Spartan-3E FPGA

AMD

超威半导体

Spartan-3E FPGA

AMD

超威半导体

Spartan-3A FPGA

AMD

超威半导体

XC3S产品属性

  • 类型

    描述

  • 型号

    XC3S

  • 制造商

    XILINX

  • 制造商全称

    XILINX

  • 功能描述

    Spartan-3 FPGA

更新时间:2025-12-24 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
XILINX(赛灵思)
24+
标准封装
8273
原厂直销,大量现货库存,交期快。价格优,支持账期
XILINX/赛灵思
24+
BGA676
7248
原厂可订货,技术支持,直接渠道。可签保供合同
XILINX/赛灵思
22+
1000000
Xilinx
25+
3000
只做原装 假一罚百 可开票 可售样
XILINX/赛灵思
1821+
BGA
215
原装现货 价格优势
XILINX
2024+
N/A
70000
柒号只做原装 现货价秒杀全网
XILINX
22+
BGA676
1000
原装优质现货订货渠道商
XILINX/赛灵思
2425+
BGA
6800
只做原装正品,每一片都来自原厂
XILINX/赛灵思(原装正品)
NEW
BGA
3000
全新原装正品,价格优势,长期供应,量大可订
XILINX/赛灵思
23+
SMD
4000

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