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XC3S400A数据手册规格书PDF详情
Module 1:
Introduction and Ordering Information
DS529-1 (v2.0) August 19, 2010
• Introduction
• Features
• Architectural and Configuration Overview
• General I/O Capabilities
• Production Status
• Supported Packages and Package Marking
• Ordering Information
Module 2:
Spartan-3A FPGA Family: Functional
Description
DS529-2 (v2.0) August 19, 2010
The functionality of the Spartan®-3A FPGA family is
described in the following documents.
• UG331: Spartan-3 Generation FPGA User Guide
• Clocking Resources
• Digital Clock Managers (DCMs)
• Block RAM
• Configurable Logic Blocks (CLBs)
- Distributed RAM
- SRL16 Shift Registers
- Carry and Arithmetic Logic
• I/O Resources
• Embedded Multiplier Blocks
• Programmable Interconnect
• ISE® Design Tools and IP Cores
• Embedded Processing and Control Solutions
• Pin Types and Package Overview
• Package Drawings
• Powering FPGAs
• Power Management
• UG332: Spartan-3 Generation Configuration User Guide
• Configuration Overview
• Configuration Pins and Behavior
• Bitstream Sizes
• Detailed Descriptions by Mode
- Master Serial Mode using Platform Flash PROM
- Master SPI Mode using Commodity Serial Flash
- Master BPI Mode using Commodity Parallel Flash
- Slave Parallel (SelectMAP) using a Processor
- Slave Serial using a Processor
- JTAG Mode
• ISE iMPACT Programming Examples
• MultiBoot Reconfiguration
• Design Authentication using Device DNA
• UG334: Spartan-3A/3AN FPGA Starter Kit User Guide
Module 3:
DC and Switching Characteristics
DS529-3 (v2.0) August 19, 2010
• DC Electrical Characteristics
• Absolute Maximum Ratings
• Supply Voltage Specifications
• Recommended Operating Conditions
• Switching Characteristics
• I/O Timing
• Configurable Logic Block (CLB) Timing
• Multiplier Timing
• Block RAM Timing
• Digital Clock Manager (DCM) Timing
• Suspend Mode Timing
• Device DNA Timing
• Configuration and JTAG Timing
Module 4:
Pinout Descriptions
DS529-4 (v2.0) August 19, 2010
• Pin Descriptions
• Package Overview
• Pinout Tables
• Footprint Diagrams
XC3S400A产品属性
- 类型
描述
- 型号
XC3S400A
- 功能描述
IC SPARTAN-3A FPGA 400K 320FBGA
- RoHS
否
- 类别
集成电路(IC) >> 嵌入式 - FPGA(现场可编程门阵列)
- 系列
Spartan®-3A
- 标准包装
40
- 系列
Spartan® 6 LX
- LAB/CLB数
3411
- 逻辑元件/单元数
43661 RAM
- 位总计
2138112
- 输入/输出数
358
- 门数
-
- 电源电压
1.14 V ~ 1.26 V
- 安装类型
表面贴装
- 工作温度
-40°C ~ 100°C
- 封装/外壳
676-BGA
- 供应商设备封装
676-FBGA(27x27)
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
XILINX |
23+ |
BGA |
690 |
专业分销产品!绝对原装正品!全国统一服务热线:400-055-6968 |
|||
XILINX/赛灵思 |
2023+ |
BGA256 |
50000 |
专注军工、汽车、医疗、工业等方案配套一站式服务 |
|||
XILINX |
23+ |
BGA |
500 |
优势渠道、优势价格 |
|||
XILINX |
23+ |
BGA3484 |
5000 |
原装正品公司现货 |
|||
XILINX |
15+ |
400-BGA |
9550 |
专营进口原装假一赔十价格优势 |
|||
XILINX/赛灵思 |
23+ |
BGA256 |
18098 |
终端可以免费供样,支持BOM配单! |
|||
XILINX/赛灵思 |
25+ |
BGA400 |
68693 |
明嘉莱只做原装正品现货 |
|||
XILINX |
25+ |
BGA256 |
160 |
原装现货 |
|||
XILINX |
20+ |
1200 |
鍘熻鐜拌揣寰︿竴缃氬崄15084837057 |
||||
XILINX/赛灵思 |
22+ |
1000000 |
XC3S400AN-5FTG256C 价格
参考价格:¥216.1931
XC3S400A 资料下载更多...
XC3S400A相关电子新闻
XC3S400AN-4FGG400C
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2020-7-8XC3S400A-4FTG256C
XC3S400A-4FTG256C深圳宇航军工半导体有限公司优势品牌:XILINX、ALTERA、SAMSUNG 、MICRON、HYNIX、NANYA 、ISSI、INTEL、TI、MAXIM、ADI、POWER、DAVICOM、PLX、CYPRESS、MARVELL、AOS、ON、ST、NXP、IR、FREESCALE、NS、AVAGO、TOSHIBA、DIODES 、RENESAS、 ATMEL、等..优
2020-7-2
XC3S400A 芯片相关型号
- 1582241
- 619-304
- 619-305
- 619-306
- 619-307
- 619-308
- 619-309
- 619-310
- ANB.00.250.NTM
- KA78L12AMTF.
- LC1D38E7
- NT6YL64M32RA3-T1
- NT6YL64M32RA3-T3
- NT6YL64M32RA5-T1
- NT6YL64M32RA5-T3
- NT6YL64M32RAA-G0
- NT6YL64M32RC5-T1
- NT6YL64M32RC5-T3
- NT6YL64M32RCA-G0
- NT6YL64M32RCA-T1
- NT6YL64M32RCA-T3
- NT6YL64M32RCQ-G0
- NT6YL64M32RCQ-T1
- NT6YL64M32RCQ-T3
- TPSB1550251800
- TPSB1550352500
- TPSB155K025#1800
- TPSB155K035#2500
- TPSB155M025#1800
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AMD相关芯片制造商
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