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XC3S200A数据手册规格书PDF详情
Module 1:
Introduction and Ordering Information
DS529-1 (v2.0) August 19, 2010
• Introduction
• Features
• Architectural and Configuration Overview
• General I/O Capabilities
• Production Status
• Supported Packages and Package Marking
• Ordering Information
Module 2:
Spartan-3A FPGA Family: Functional
Description
DS529-2 (v2.0) August 19, 2010
The functionality of the Spartan®-3A FPGA family is
described in the following documents.
• UG331: Spartan-3 Generation FPGA User Guide
• Clocking Resources
• Digital Clock Managers (DCMs)
• Block RAM
• Configurable Logic Blocks (CLBs)
- Distributed RAM
- SRL16 Shift Registers
- Carry and Arithmetic Logic
• I/O Resources
• Embedded Multiplier Blocks
• Programmable Interconnect
• ISE® Design Tools and IP Cores
• Embedded Processing and Control Solutions
• Pin Types and Package Overview
• Package Drawings
• Powering FPGAs
• Power Management
• UG332: Spartan-3 Generation Configuration User Guide
• Configuration Overview
• Configuration Pins and Behavior
• Bitstream Sizes
• Detailed Descriptions by Mode
- Master Serial Mode using Platform Flash PROM
- Master SPI Mode using Commodity Serial Flash
- Master BPI Mode using Commodity Parallel Flash
- Slave Parallel (SelectMAP) using a Processor
- Slave Serial using a Processor
- JTAG Mode
• ISE iMPACT Programming Examples
• MultiBoot Reconfiguration
• Design Authentication using Device DNA
• UG334: Spartan-3A/3AN FPGA Starter Kit User Guide
Module 3:
DC and Switching Characteristics
DS529-3 (v2.0) August 19, 2010
• DC Electrical Characteristics
• Absolute Maximum Ratings
• Supply Voltage Specifications
• Recommended Operating Conditions
• Switching Characteristics
• I/O Timing
• Configurable Logic Block (CLB) Timing
• Multiplier Timing
• Block RAM Timing
• Digital Clock Manager (DCM) Timing
• Suspend Mode Timing
• Device DNA Timing
• Configuration and JTAG Timing
Module 4:
Pinout Descriptions
DS529-4 (v2.0) August 19, 2010
• Pin Descriptions
• Package Overview
• Pinout Tables
• Footprint Diagrams
XC3S200A产品属性
- 类型
描述
- 型号
XC3S200A
- 制造商
XILINX
- 制造商全称
XILINX
- 功能描述
Very low cost, high-performance logic solution forhigh-volume, cost-conscious applications
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
XILINX |
23+ |
BGA256 |
450 |
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|||
XILINX |
2018+ |
QFP |
3000 |
全新原装真实库存含13点增值税票! |
|||
XILINX |
24+ |
BGA-256 |
500 |
“芯达集团”专注军工宇航级元器件,欢迎来电咨询 |
|||
XILINX原装 |
24+ |
BGA256 |
6000 |
||||
XILINX |
23+ |
QFP100 |
3500 |
原装现货!假一罚十!可含税! |
|||
XILINX/赛灵思 |
21+ |
TQFP100 |
4500 |
只做原装正品假一赔十为客户做到零风险 |
|||
XILINX |
21+ |
QFP100 |
9000 |
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|||
XILINX |
23+ |
QFP |
10000 |
□原装进口价格好实需详询□□□□QQ350053121 |
|||
XILINX |
15+ |
256-LBGA |
9550 |
专营进口原装假一赔十价格优势 |
|||
XILINX |
2020+ |
FBGA256 |
1767 |
百分百原装正品 真实公司现货库存 本公司只做原装 可 |
XC3S200AN-5FTG256C 价格
参考价格:¥197.2662
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XC3S200AN-4FTG256C详细规格参数
2020-10-27XC3S200A-4 VQG100C
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2020-6-29
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Advanced Micro Devices 美国超威半导体公司
Advanced Micro Devices, Inc.(AMD)是一家全球领先的半导体公司,成立于1969年,总部位于美国加利福尼亚州的桑尼韦尔。AMD专注于设计和制造高性能计算、图形和视觉计算技术,产品涵盖处理器、图形卡、嵌入式系统等多个领域,广泛应用于个人电脑、工作站、服务器、游戏、数据中心及嵌入式设备等。 AMD在技术创新方面不断取得突破,推出了多个标志性的产品,如Ryzen系列处理器、EPYC服务器处理器、Radeon系列显卡等。公司以其优异的性能和能效比在市场上获得了良好的声誉,特别是在游戏和高性能计算领域受到广泛认可。 近年来,AMD积极推动开放架构和高效能计算领域的发展,致力于