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XC3S1400A数据手册规格书PDF详情
Module 1:
Introduction and Ordering Information
DS529-1 (v2.0) August 19, 2010
• Introduction
• Features
• Architectural and Configuration Overview
• General I/O Capabilities
• Production Status
• Supported Packages and Package Marking
• Ordering Information
Module 2:
Spartan-3A FPGA Family: Functional
Description
DS529-2 (v2.0) August 19, 2010
The functionality of the Spartan®-3A FPGA family is
described in the following documents.
• UG331: Spartan-3 Generation FPGA User Guide
• Clocking Resources
• Digital Clock Managers (DCMs)
• Block RAM
• Configurable Logic Blocks (CLBs)
- Distributed RAM
- SRL16 Shift Registers
- Carry and Arithmetic Logic
• I/O Resources
• Embedded Multiplier Blocks
• Programmable Interconnect
• ISE® Design Tools and IP Cores
• Embedded Processing and Control Solutions
• Pin Types and Package Overview
• Package Drawings
• Powering FPGAs
• Power Management
• UG332: Spartan-3 Generation Configuration User Guide
• Configuration Overview
• Configuration Pins and Behavior
• Bitstream Sizes
• Detailed Descriptions by Mode
- Master Serial Mode using Platform Flash PROM
- Master SPI Mode using Commodity Serial Flash
- Master BPI Mode using Commodity Parallel Flash
- Slave Parallel (SelectMAP) using a Processor
- Slave Serial using a Processor
- JTAG Mode
• ISE iMPACT Programming Examples
• MultiBoot Reconfiguration
• Design Authentication using Device DNA
• UG334: Spartan-3A/3AN FPGA Starter Kit User Guide
Module 3:
DC and Switching Characteristics
DS529-3 (v2.0) August 19, 2010
• DC Electrical Characteristics
• Absolute Maximum Ratings
• Supply Voltage Specifications
• Recommended Operating Conditions
• Switching Characteristics
• I/O Timing
• Configurable Logic Block (CLB) Timing
• Multiplier Timing
• Block RAM Timing
• Digital Clock Manager (DCM) Timing
• Suspend Mode Timing
• Device DNA Timing
• Configuration and JTAG Timing
Module 4:
Pinout Descriptions
DS529-4 (v2.0) August 19, 2010
• Pin Descriptions
• Package Overview
• Pinout Tables
• Footprint Diagrams
XC3S1400A产品属性
- 类型
描述
- 型号
XC3S1400A
- 制造商
XILINX
- 制造商全称
XILINX
- 功能描述
Very low cost, high-performance logic solution forhigh-volume, cost-conscious applications
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
AMD/XILINX(赛灵思) |
FBGA-484 |
12 |
|||||
XilinxInc |
14+ |
BGA256 |
2400 |
原厂授权一级代理,专注军工、汽车、医疗、工业、新能源、电力! |
|||
XILINX |
24+ |
676FBGA |
859 |
只做原装假一罚十 |
|||
XILINX/赛灵思 |
22+ |
BGA256 |
1360 |
XILINX原厂渠道 现货库存 专业FPGA分销商 |
|||
XILINX |
BGA |
5800 |
专业分销全系列产品!绝对原装正品!量大可订!价格优 |
||||
XILINX |
24+ |
SMD |
600 |
“芯达集团”专营军工百分之百原装进口 |
|||
XILINX |
25+ |
BGA676 |
4325 |
原装现货,提供一站式配套服务! |
|||
XILINX |
23+ |
BGA |
204 |
优势渠道、优势价格 |
|||
XILINX |
24+ |
BGA676 |
680 |
十年信誉,只做全新原装正品现货,价格优势!! |
|||
XILINX/赛灵思 |
22+ |
1000000 |
XC3S1400AN-5FGG676C 价格
参考价格:¥812.0374
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XC3S1400A相关电子新闻
XC3S1400AFTG256
XC3S1400AFTG256用于众多应用领域,如通信系统、计算机网络、嵌入式系统、图像处理、音频处理等。
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2020-7-22XC3S1400AN-4FG676C
Spartan-7FPGA-现场可编程门阵列,UBGA-169FPGA-现场可编程门阵列,ZynqUltraScale+MPSoCFPGA-现场可编程门阵列,VirtexUltraScale+FPGA-现场可编程门阵列,408I/OFPGA-现场可编程门阵列,UBGA-169MAX10FPGA-现场可编程门阵列
2020-7-13XC3S1400AN-4FGG484C
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2020-7-13XC3S1400A-4FGG484C
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2020-7-8
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Advanced Micro Devices 美国超威半导体公司
Advanced Micro Devices, Inc.(AMD)是一家全球领先的半导体公司,成立于1969年,总部位于美国加利福尼亚州的桑尼韦尔。AMD专注于设计和制造高性能计算、图形和视觉计算技术,产品涵盖处理器、图形卡、嵌入式系统等多个领域,广泛应用于个人电脑、工作站、服务器、游戏、数据中心及嵌入式设备等。 AMD在技术创新方面不断取得突破,推出了多个标志性的产品,如Ryzen系列处理器、EPYC服务器处理器、Radeon系列显卡等。公司以其优异的性能和能效比在市场上获得了良好的声誉,特别是在游戏和高性能计算领域受到广泛认可。 近年来,AMD积极推动开放架构和高效能计算领域的发展,致力于