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XC3S400AN数据手册规格书PDF详情
Module 1:
Introduction and Ordering Information
DS557 (v4.2) June 12, 2014
• Introduction
• Features
• Architectural Overview
• Configuration Overview
• In-system Flash Memory Overview
• General I/O Capabilities
• Supported Packages and Package Marking
• Ordering Information
Module 2:
Functional Description
DS557 (v4.2) June 12, 2014
The functionality of the Spartan®-3AN FPGA family is
described in the following documents:
• UG331: Spartan-3 Generation FPGA User Guide
• Clocking Resources
• Digital Clock Managers (DCMs)
• Block RAM
• Configurable Logic Blocks (CLBs)
- Distributed RAM
- SRL16 Shift Registers
- Carry and Arithmetic Logic
• I/O Resources
• Embedded Multiplier Blocks
• Programmable Interconnect
• ISE® Design Tools and IP Cores
• Embedded Processing and Control Solutions
• Pin Types and Package Overview
• Package Drawings
• Powering FPGAs
• Power Management
• UG332: Spartan-3 Generation Configuration User Guide
• Configuration Overview
• Configuration Pins and Behavior
• Bitstream Sizes
• Detailed Descriptions by Mode
- Self-contained In-System Flash mode
- Master Serial Mode using Platform Flash PROM
- Master SPI Mode using Commodity Serial Flash
- Master BPI Mode using Commodity Parallel Flash
- Slave Parallel (SelectMAP) using a Processor
- Slave Serial using a Processor
- JTAG Mode
• ISE iMPACT Programming Examples
• MultiBoot Reconfiguration
• Design Authentication using Device DNA
• UG333: Spartan-3AN In-System Flash User Guide
• UG334: Spartan-3AN Starter Kit User Guide
Module 3:
DC and Switching Characteristics
DS557 (v4.2) June 12, 2014
• DC Electrical Characteristics
• Absolute Maximum Ratings
• Supply Voltage Specifications
• Recommended Operating Conditions
• Switching Characteristics
• I/O Timing
• Configurable Logic Block (CLB) Timing
• Multiplier Timing
• Block RAM Timing
• Digital Clock Manager (DCM) Timing
• Suspend Mode Timing
• Device DNA Timing
• Configuration and JTAG Timing
Module 4:
Pinout Descriptions
DS557 (v4.2) June 12, 2014
• Pin Descriptions
• Package Overview
• Pinout Tables
• Footprint Diagrams
XC3S400AN产品属性
- 类型
描述
- 型号
XC3S400AN
- 制造商
Xilinx
- 功能描述
FPGA SPARTAN-3AN 400K GATES 8064 CELLS 667MHZ 1.2V 400FBGA - Trays
- 制造商
Xilinx
- 功能描述
IC FPGA SPARTAN-3AN 400K 400BGA
- 制造商
Xilinx
- 功能描述
IC FPGA 311 I/O 400FBGA
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
XILINX |
23+ |
BGA |
500 |
优势渠道、优势价格 |
|||
XILINX |
23+ |
BGA3484 |
5000 |
原装正品公司现货 |
|||
XILINX |
15+ |
400-BGA |
9550 |
专营进口原装假一赔十价格优势 |
|||
Xilinx |
24+ |
256-FTBGA(17x17) |
66800 |
原厂授权一级代理,专注军工、汽车、医疗、工业、新能源、电力! |
|||
XILINX/赛灵思 |
25+ |
BGA400 |
68693 |
明嘉莱只做原装正品现货 |
|||
XILINX |
21+ |
BGAQFP |
624 |
十年专营,供应正品现货, |
|||
XILINX/赛灵思 |
22+ |
1000000 |
|||||
XILINX/赛灵思 |
23+ |
BGA |
719 |
全新原装现货 |
|||
XILINX |
24+ |
BGA@1 |
2400 |
只做原装 有挂有货 假一赔十 |
|||
XILINX |
23+ |
BGA400 |
2500 |
亚太地区XILINX(赛灵思)专业分销商公司专卖产品 |
XC3S400AN-5FTG256C 价格
参考价格:¥216.1931
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XC3S400AN相关电子新闻
XC3S400AN-4FGG400C
FCBGA-484FPGA-现场可编程门阵列,UBGA-484FPGA-现场可编程门阵列,476I/OFPGA-现场可编程门阵列,EQFP-144FPGA-现场可编程门阵列,Spartan-7150I/OFPGA-现场可编程门阵列,FBGA-484-40CFPGA-现场可编程门阵列
2020-7-21
XC3S400AN 芯片相关型号
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Advanced Micro Devices 美国超威半导体公司
Advanced Micro Devices, Inc.(AMD)是一家全球领先的半导体公司,成立于1969年,总部位于美国加利福尼亚州的桑尼韦尔。AMD专注于设计和制造高性能计算、图形和视觉计算技术,产品涵盖处理器、图形卡、嵌入式系统等多个领域,广泛应用于个人电脑、工作站、服务器、游戏、数据中心及嵌入式设备等。 AMD在技术创新方面不断取得突破,推出了多个标志性的产品,如Ryzen系列处理器、EPYC服务器处理器、Radeon系列显卡等。公司以其优异的性能和能效比在市场上获得了良好的声誉,特别是在游戏和高性能计算领域受到广泛认可。 近年来,AMD积极推动开放架构和高效能计算领域的发展,致力于