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XC3S200AN-4FTG256C数据手册规格书PDF详情
Module 1:
Introduction and Ordering Information
DS557 (v4.2) June 12, 2014
• Introduction
• Features
• Architectural Overview
• Configuration Overview
• In-system Flash Memory Overview
• General I/O Capabilities
• Supported Packages and Package Marking
• Ordering Information
Module 2:
Functional Description
DS557 (v4.2) June 12, 2014
The functionality of the Spartan®-3AN FPGA family is
described in the following documents:
• UG331: Spartan-3 Generation FPGA User Guide
• Clocking Resources
• Digital Clock Managers (DCMs)
• Block RAM
• Configurable Logic Blocks (CLBs)
- Distributed RAM
- SRL16 Shift Registers
- Carry and Arithmetic Logic
• I/O Resources
• Embedded Multiplier Blocks
• Programmable Interconnect
• ISE® Design Tools and IP Cores
• Embedded Processing and Control Solutions
• Pin Types and Package Overview
• Package Drawings
• Powering FPGAs
• Power Management
• UG332: Spartan-3 Generation Configuration User Guide
• Configuration Overview
• Configuration Pins and Behavior
• Bitstream Sizes
• Detailed Descriptions by Mode
- Self-contained In-System Flash mode
- Master Serial Mode using Platform Flash PROM
- Master SPI Mode using Commodity Serial Flash
- Master BPI Mode using Commodity Parallel Flash
- Slave Parallel (SelectMAP) using a Processor
- Slave Serial using a Processor
- JTAG Mode
• ISE iMPACT Programming Examples
• MultiBoot Reconfiguration
• Design Authentication using Device DNA
• UG333: Spartan-3AN In-System Flash User Guide
• UG334: Spartan-3AN Starter Kit User Guide
Module 3:
DC and Switching Characteristics
DS557 (v4.2) June 12, 2014
• DC Electrical Characteristics
• Absolute Maximum Ratings
• Supply Voltage Specifications
• Recommended Operating Conditions
• Switching Characteristics
• I/O Timing
• Configurable Logic Block (CLB) Timing
• Multiplier Timing
• Block RAM Timing
• Digital Clock Manager (DCM) Timing
• Suspend Mode Timing
• Device DNA Timing
• Configuration and JTAG Timing
Module 4:
Pinout Descriptions
DS557 (v4.2) June 12, 2014
• Pin Descriptions
• Package Overview
• Pinout Tables
• Footprint Diagrams
XC3S200AN-4FTG256C产品属性
- 类型
描述
- 型号
XC3S200AN-4FTG256C
- 功能描述
IC SPARTAN-3AN FPGA 200K 256FTBG
- RoHS
是
- 类别
集成电路(IC) >> 嵌入式 - FPGA(现场可编程门阵列)
- 系列
Spartan®-3AN
- 标准包装
60
- 系列
XP
- LAB/CLB数
-
- 逻辑元件/单元数
10000 RAM
- 位总计
221184
- 输入/输出数
244
- 门数
-
- 电源电压
1.71 V ~ 3.465 V
- 安装类型
表面贴装
- 工作温度
0°C ~ 85°C
- 封装/外壳
388-BBGA
- 供应商设备封装
388-FPBGA(23x23)
- 其它名称
220-1241
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
AMD/XILINX(赛灵思) |
FTBGA-256 |
78 |
|||||
XILINX |
23+ |
BGA256 |
450 |
百分之百优势产品,全新原装,可开17%增票! |
|||
XILINX原装 |
24+ |
BGA256 |
6000 |
||||
XILINX |
15+ |
256-LBGA |
9550 |
专营进口原装假一赔十价格优势 |
|||
Xilinx |
24+ |
256-FTBGA( |
66800 |
原厂授权一级代理,专注军工、汽车、医疗、工业、新能源、电力! |
|||
XILINX/赛灵思 |
23+ |
BGA256 |
18098 |
终端可以免费供样,支持BOM配单! |
|||
XILINX |
2041+ |
1300 |
鍘熻鐜拌揣寰︿竴缃氬崄15084837057 |
||||
XILINX/赛灵思 |
23+ |
BGA |
834 |
全新原装现货 |
|||
BROADCOM |
23+ |
6000 |
价格优势绝对原装正品现货假一罚十 |
||||
XILINX(赛灵思) |
24+ |
FTBGA-256(17x17) |
5585 |
只做原装现货假一罚十!价格最低!只卖原装现货 |
XC3S200AN-4FTG256C 价格
参考价格:¥157.1448
XC3S200AN-4FTG256C 资料下载更多...
XC3S200AN-4FTG256C相关电子新闻
XC3S200AN-4FTG256C
XC3S200AN-4FTG256C详细规格参数
2020-10-27
XC3S200AN-4FTG256C 芯片相关型号
- 108003
- 15KPA36A
- 2050338000
- CA-RSPNMB
- CA-RSPNMB010
- CD40257BE
- CD40257BE.A
- CD40257BEE4
- CD40257BF3A
- CD40257BF3A.A
- CD40257BM
- CD40257BM.A
- D38999SLASH20JG16JA
- D38999SLASH20JG16JA-LC
- D38999SLASH20JG16JB
- D38999SLASH20JG16JB-LC
- GS81332DT19CE-250MV
- SES-1C2-BSLASHE2
- SES-1C2-BSLASHQ
- SES-1C2-C
- SES-1C2-CSLASHE
- SES-1C2-CSLASHE2
- UC2902D.A
- UC2902DG4
- UC2902DTR
- UC2902DTR.A
- UC2902N
- UC2902N.A
- XC3S200AN
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Advanced Micro Devices 美国超威半导体公司
Advanced Micro Devices, Inc.(AMD)是一家全球领先的半导体公司,成立于1969年,总部位于美国加利福尼亚州的桑尼韦尔。AMD专注于设计和制造高性能计算、图形和视觉计算技术,产品涵盖处理器、图形卡、嵌入式系统等多个领域,广泛应用于个人电脑、工作站、服务器、游戏、数据中心及嵌入式设备等。 AMD在技术创新方面不断取得突破,推出了多个标志性的产品,如Ryzen系列处理器、EPYC服务器处理器、Radeon系列显卡等。公司以其优异的性能和能效比在市场上获得了良好的声誉,特别是在游戏和高性能计算领域受到广泛认可。 近年来,AMD积极推动开放架构和高效能计算领域的发展,致力于