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XC3S200AN数据手册规格书PDF详情
Module 1:
Introduction and Ordering Information
DS557 (v4.2) June 12, 2014
• Introduction
• Features
• Architectural Overview
• Configuration Overview
• In-system Flash Memory Overview
• General I/O Capabilities
• Supported Packages and Package Marking
• Ordering Information
Module 2:
Functional Description
DS557 (v4.2) June 12, 2014
The functionality of the Spartan®-3AN FPGA family is
described in the following documents:
• UG331: Spartan-3 Generation FPGA User Guide
• Clocking Resources
• Digital Clock Managers (DCMs)
• Block RAM
• Configurable Logic Blocks (CLBs)
- Distributed RAM
- SRL16 Shift Registers
- Carry and Arithmetic Logic
• I/O Resources
• Embedded Multiplier Blocks
• Programmable Interconnect
• ISE® Design Tools and IP Cores
• Embedded Processing and Control Solutions
• Pin Types and Package Overview
• Package Drawings
• Powering FPGAs
• Power Management
• UG332: Spartan-3 Generation Configuration User Guide
• Configuration Overview
• Configuration Pins and Behavior
• Bitstream Sizes
• Detailed Descriptions by Mode
- Self-contained In-System Flash mode
- Master Serial Mode using Platform Flash PROM
- Master SPI Mode using Commodity Serial Flash
- Master BPI Mode using Commodity Parallel Flash
- Slave Parallel (SelectMAP) using a Processor
- Slave Serial using a Processor
- JTAG Mode
• ISE iMPACT Programming Examples
• MultiBoot Reconfiguration
• Design Authentication using Device DNA
• UG333: Spartan-3AN In-System Flash User Guide
• UG334: Spartan-3AN Starter Kit User Guide
Module 3:
DC and Switching Characteristics
DS557 (v4.2) June 12, 2014
• DC Electrical Characteristics
• Absolute Maximum Ratings
• Supply Voltage Specifications
• Recommended Operating Conditions
• Switching Characteristics
• I/O Timing
• Configurable Logic Block (CLB) Timing
• Multiplier Timing
• Block RAM Timing
• Digital Clock Manager (DCM) Timing
• Suspend Mode Timing
• Device DNA Timing
• Configuration and JTAG Timing
Module 4:
Pinout Descriptions
DS557 (v4.2) June 12, 2014
• Pin Descriptions
• Package Overview
• Pinout Tables
• Footprint Diagrams
XC3S200AN产品属性
- 类型
描述
- 型号
XC3S200AN
- 功能描述
IC SPARTAN-3AN FPGA 200K 256FTBG
- RoHS
是
- 类别
集成电路(IC) >> 嵌入式 - FPGA(现场可编程门阵列)
- 系列
Spartan®-3AN
- 标准包装
60
- 系列
XP
- LAB/CLB数
-
- 逻辑元件/单元数
10000 RAM
- 位总计
221184
- 输入/输出数
244
- 门数
-
- 电源电压
1.71 V ~ 3.465 V
- 安装类型
表面贴装
- 工作温度
0°C ~ 85°C
- 封装/外壳
388-BBGA
- 供应商设备封装
388-FPBGA(23x23)
- 其它名称
220-1241
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
XILINX |
23+ |
BGA256 |
450 |
百分之百优势产品,全新原装,可开17%增票! |
|||
XILINX |
24+ |
BGA-256 |
500 |
“芯达集团”专注军工宇航级元器件,欢迎来电咨询 |
|||
XILINX原装 |
24+ |
BGA256 |
6000 |
||||
XILINX |
15+ |
256-LBGA |
9550 |
专营进口原装假一赔十价格优势 |
|||
XILINX/赛灵思 |
23+ |
BGA256 |
18098 |
终端可以免费供样,支持BOM配单! |
|||
XILINX |
2041+ |
1300 |
鍘熻鐜拌揣寰︿竴缃氬崄15084837057 |
||||
XILINX/赛灵思 |
22+ |
1000000 |
|||||
XILINX |
24+ |
BGA |
2000 |
只做原装 有挂有货 假一赔十 |
|||
XILINX(赛灵思) |
24+ |
标准封装 |
9048 |
原厂直销,大量现货库存,交期快。价格优,支持账期 |
|||
XILINX(赛灵思) |
24+ |
FTBGA-256(17x17) |
5585 |
只做原装现货假一罚十!价格最低!只卖原装现货 |
XC3S200AN-5FTG256C 价格
参考价格:¥197.2662
XC3S200AN 资料下载更多...
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XC3S200AN-5FTG256C深圳宇航军工半导体有限公司优势品牌:XILINX、ALTERA、INTEL、TI、MAXIM、ADI、POWER、SAMSUNG 、MICRON、HYNIX、NANYA 、ISSI、DAVICOM、PLX、CYPRESS、MARVELL、AOS、ON、ST、NXP、IR、FREESCALE、NS、AVAGO、TOSHIBA、DIODES 、RENESAS、 ATMEL、等..
2020-6-29
XC3S200AN 芯片相关型号
- 108003
- 15KPA36A
- 2050338000
- CA-RSPNMB
- CA-RSPNMB010
- CD40257BE
- CD40257BE.A
- CD40257BEE4
- CD40257BF3A
- CD40257BF3A.A
- CD40257BM
- CD40257BM.A
- D38999SLASH20JG16JA
- D38999SLASH20JG16JA-LC
- D38999SLASH20JG16JB
- D38999SLASH20JG16JB-LC
- GS81332DT19CE-250MV
- SES-1C2-BSLASHQ
- SES-1C2-C
- SES-1C2-CSLASHE
- SES-1C2-CSLASHE2
- UC2902D.A
- UC2902DG4
- UC2902DTR
- UC2902DTR.A
- UC2902N
- UC2902N.A
- XC3S200AN-4FTG256C
AMD相关芯片制造商
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