型号 功能描述 生产厂家 企业 LOGO 操作
STGIPN3H60-E

封装/外壳:26-PowerDIP 模块(0.846",21.48mm) 包装:管件 描述:PWR MODULE 600V 3A 26-POWERDIP 分立半导体产品 功率驱动器模块

STMICROELECTRONICS

意法半导体

STGIPN3H60-E

PWR MODULE 600V 3A 26-POWERDIP

STMICROELECTRONICS

意法半导体

Surface Mount Ultra Low IR Schottky Rectifier

Features  Ultra low IR  Ideal for automated placement  Low power loss, high efficiency  High surge current capability  AEC-Q101 qualified  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

PANJIT

強茂

Surface Mount Ultra Low IR Schottky Barrier Rectifier

Features  Low leakage current  Ideal for automated placement  Low power loss, high efficiency  High surge current capability  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

PANJIT

強茂

Surface Mount Ultra Low IR Schottky Barrier Rectifier

Features  Low leakage current  Ideal for automated placement  Low power loss, high efficiency  High surge current capability  AEC-Q101 qualified  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

PANJIT

強茂

Surface Mount Ultra Low IR Schottky Barrier Rectifier

Features  Low leakage current  Ideal for automated placement  Low power loss, high efficiency  High surge current capability  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

PANJIT

強茂

SCHOTTKY RECTIFIER

文件:155.75 Kbytes Page:4 Pages

PANJIT

強茂

更新时间:2025-11-22 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ST(意法半导体)
24+
DIP26
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
ST(意法)
24+
NA/
8735
原厂直销,现货供应,账期支持!
ST/意法半导体
21+
NDIP-26
8860
只做原装,质量保证
ST/意法
23+
DIP26
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
ST(意法)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
ST/意法半导体
21+
NDIP-26
8860
原装现货,实单价优
ST/意法
21+
DIP26
5000
优势供应 实单必成 可开增值税13点
24+
16184
ST/意法
23+
DIP26
8000
原装正品实单必成
ST/意法半导体
23+
NDIP-26
12820
正规渠道,只有原装!

STGIPN3H60-E数据表相关新闻