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型号	功能描述	生产厂家企业	LOGO
CC2640R2	CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka	TI 德州仪器	TI
CC2640R2	CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C	TI 德州仪器	TI
CC2640R2F	CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl	TI 德州仪器	TI
CC2640R2F	CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (	TI 德州仪器	TI
CC2640R2F	CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-	TI 德州仪器	TI
CC2640R2F	CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl	TI 德州仪器	TI
CC2640R2F	CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod	TI 德州仪器	TI
CC2640R2F	CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl	TI 德州仪器	TI
CC2640R2F	CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3	TI 德州仪器	TI
CC2640R2F	CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3	TI 德州仪器	TI
CC2640R2F	CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis	TI 德州仪器	TI
CC2640R2F	CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis	TI 德州仪器	TI
CC2640R2F	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2F	CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag	TI 德州仪器	TI
CC2640R2F	CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le	TI 德州仪器	TI
CC2640R2F	CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth®	TI 德州仪器	TI
CC2640R2F	CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le	TI 德州仪器	TI
CC2640R2F-Q1	CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag	TI 德州仪器	TI
CC2640R2F-Q1	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZ	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZR	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZR.A	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZR.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZRG4	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZRG4.A	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZRG4.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZT	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZT.A	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRGZT.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRHB	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRHBR	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRHBR.A	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRHBR.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRHBT	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRHBT.A	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRHBT.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRSM	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRSMR	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRSMR.A	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRSMR.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRSMT	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRSMT.A	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FRSMT.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FXXX	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FYFV	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FYFVR	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FYFVR.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FYFVT	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2FYFVT.B	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys	TI 德州仪器	TI
CC2640R2F	SimpleLink Bluetooth low energy Wireless MCU 文件：1.97981 Mbytes Page：64 Pages	TI 德州仪器	TI
CC2640R2F	SimpleLink Bluetooth low energy Wireless MCU for Automotive 文件：1.36076 Mbytes Page：40 Pages	TI 德州仪器	TI
CC2640R2F	CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件：3.51768 Mbytes Page：63 Pages	TI 德州仪器	TI
CC2640R2F-Q1	符合汽车标准的 SimpleLink™ 32 位 Arm Cortex-M3 低功耗 Bluetooth® 无线 MCU	TI 德州仪器	TI
CC2640R2F-Q1	SimpleLink Bluetooth low energy Wireless MCU for Automotive 文件：1.36076 Mbytes Page：40 Pages	TI 德州仪器	TI
CC2640R2FRGZR	SimpleLink Bluetooth low energy Wireless MCU 文件：1.97981 Mbytes Page：64 Pages	TI 德州仪器	TI
CC2640R2FRGZT	SimpleLink Bluetooth low energy Wireless MCU 文件：1.97981 Mbytes Page：64 Pages	TI 德州仪器	TI
CC2640R2FRGZT	封装/外壳：48-VFQFN 裸露焊盘包装：托盘描述：IC RF TXRX+MCU BLE 5.1 48VQFN RF/IF，射频/中频和 RFID 射频收发器 IC	TI 德州仪器	TI
CC2640R2FRHBR	SimpleLink Bluetooth low energy Wireless MCU 文件：1.97981 Mbytes Page：64 Pages	TI 德州仪器	TI
CC2640R2FRHBR	封装/外壳：32-VFQFN 裸露焊盘包装：管件描述：IC RF TXRX+MCU BLUETOOTH 32VFQFN RF/IF，射频/中频和 RFID 射频收发器 IC	TI 德州仪器	TI
CC2640R2FRHBT	SimpleLink Bluetooth low energy Wireless MCU 文件：1.97981 Mbytes Page：64 Pages	TI 德州仪器	TI

CC2640R2供应商更多...

更新时间：2025-12-26 19:04:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
中天科工半导体（深圳）有限公司	CC2640R2FRHBT	TI/德州仪器	25+	VQFN-32	36000	TI/德州仪器全新特价CC2640R2FRHBT即刻询购立享优惠#长期有货	询价
深圳市科恒伟业电子有限公司	CC2640R2FRGZR	TI	22+	QFN	15000	只做原装正品假一赔十！正规渠道订货！	询价
深圳市英博尔电子有限公司	CC2640R2LRHBR	TI	23+	VQFN32	10000	全新、原装	询价
深圳市星辰微电科技有限公司	CC2640R2LRGZR	TI	23+	VQFN48	18000	仓库现货，下单就发货	询价
深圳市云美电子科技有限公司	CC2640R2FRSMR	TI/德州仪器	24+	VQFN32	9000	只做全新原装进口现货	询价
深圳市粤骏腾电子科技有限公司	CC2640R2FRGZR	TI	24+	VQFN48	15000	原装正品现货	询价
深圳市得捷芯城科技有限公司	CC2640R2FRHB	TI(德州仪器)	24+	标准封装	8098	原厂直销,大量现货库存,交期快。价格优,支持账期	询价
深圳市科雨电子有限公司	CC2640R2FRGZR	TI/德州仪器	25+	QFN	10000	就找我吧!--邀您体验愉快问购元件!	询价
深圳市盈慧通电子有限公司	CC2640R2FRSMR	TI(德州仪器)	2511	N/A	6000	电子元器件采购降本 30%!公司原厂直采,砍掉中间差价	询价
深圳市中飞凌科技有限公司	CC2640R2FRGZR	TI	26+	WQFN48	100000	全新原装正品代理渠道，假一赔十	询价

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