型号 功能描述 生产厂家 企业 LOGO 操作
CC2640R2FYFV

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

封装/外壳:34-UFBGA,DSBGA 包装:管件 描述:IC RF TXRX+MCU BLE 5.1 34DSBGA RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

封装/外壳:34-UFBGA,DSBGA 包装:管件 描述:IC RF TXRX+MCU BLE 5.1 34DSBGA RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

更新时间:2026-3-15 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
25+
N/A
18798
正规渠道,免费送样。支持账期,BOM一站式配齐
Texas Instruments
24+
DSBGA-34
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
TI
24+
DSBGA34
8000
新到现货,只做全新原装正品
TI
24+
DSBGA34
3250
市场最低 原装现货 假一罚百 可开原型号
TI 热卖
23+
DSBGA34
1000
正规渠道,只有原装!
TI 热卖
24+
DSBGA34
5000
全新原装正品,现货销售
TI/德州仪器
25+
DSBGA-34
860000
明嘉莱只做原装正品现货
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI(德州仪器)
23+
N/A
6000
公司只做原装,可来电咨询
一级代理
23+
N/A
7000

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