型号 功能描述 生产厂家 企业 LOGO 操作
CC2640R2FYFVT

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2640R2FYFVT

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

CC2640R2FYFVT

封装/外壳:34-UFBGA,DSBGA 包装:管件 描述:IC RF TXRX+MCU BLE 5.1 34DSBGA RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU for Automotive

文件:1.36076 Mbytes Page:40 Pages

TI

德州仪器

更新时间:2026-1-1 9:38:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
DSBGA34
7798
原厂可订货,技术支持,直接渠道。可签保供合同
Texas Instruments
24+
DSBGA-34
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
TI/德州仪器
23+
34-UFBGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
TI
24+
VQFN
17900
一级授权代理原装现货热卖
TI
24+
DSBGA34
2500
市场最低 原装现货 假一罚百 可开原型号
TI/德州仪器
23+
DSBGA-34
12700
买原装认准中赛美
TI
24+
DSBGA34
8000
新到现货,只做全新原装正品
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
TI(德州仪器)
2511
N/A
6000
电子元器件采购降本 30%!原厂直采,砍掉中间差价
TI
21+正纳原装现货
DSBGA34
2500
十年以上分销商原装进口件服务型

CC2640R2FYFVT数据表相关新闻