型号 功能描述 生产厂家 企业 LOGO 操作
CC2640R2FYFVT

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2640R2FYFVT

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

CC2640R2FYFVT

封装/外壳:34-UFBGA,DSBGA 包装:管件 描述:IC RF TXRX+MCU BLE 5.1 34DSBGA RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU for Automotive

文件:1.36076 Mbytes Page:40 Pages

TI

德州仪器

更新时间:2026-1-1 14:36:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
24+
DSBGA34
2500
市场最低 原装现货 假一罚百 可开原型号
TI(德州仪器)
24+
N/A
17600
原装正品现货支持实单
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
TI
24+
VQFN
17900
一级授权代理原装现货热卖
TI/德州仪器
25+
BGA-34
32360
TI/德州仪器全新特价CC2640R2FYFVT即刻询购立享优惠#长期有货
TI
23+
34-UFBGA
25000
TI现货商!原装正品!
TI/德州仪器
DSBGA-34
6000
只做原装正品,卖元器件不赚钱交个朋友
TI(德州仪器)
2511
N/A
6000
电子元器件采购降本 30%!原厂直采,砍掉中间差价
TI/德州仪器
2020+
DSBGA-34
7600
TI
24+
DSBGA34
12000
现货,来电咨询

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