型号 功能描述 生产厂家&企业 LOGO 操作
CC2640R2F

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI1

德州仪器

CC2640R2F

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

TI

德州仪器

CC2640R2F

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

TI

德州仪器

CC2640R2F

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

CC2640R2F

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

TI1

德州仪器

CC2640R2F

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI1

德州仪器

CC2640R2F

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI1

德州仪器

CC2640R2F

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

TI1

德州仪器

CC2640R2F

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI1

德州仪器

CC2640R2F

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

TI1

德州仪器

CC2640R2F

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

CC2640R2F

SimpleLink Bluetooth low energy Wireless MCU for Automotive

文件:1.36076 Mbytes Page:40 Pages

TI1

德州仪器

CC2640R2F

CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

文件:3.51768 Mbytes Page:63 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU for Automotive

文件:1.36076 Mbytes Page:40 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:托盘 描述:IC RF TXRX+MCU BLE 5.1 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI2

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU BLUETOOTH 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI2

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU for Automotive

文件:1.36076 Mbytes Page:40 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU for Automotive

文件:1.36076 Mbytes Page:40 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU for Automotive

文件:1.36076 Mbytes Page:40 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI1

德州仪器

更新时间:2025-8-11 23:39:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
25+
VQFN-32
36000
TI/德州仪器全新特价CC2640R2FRHBT即刻询购立享优惠#长期有货
TI(德州仪器)
24+
标准封装
8098
原厂直销,大量现货库存,交期快。价格优,支持账期
TI(德州仪器)
24+
NA/
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
TI/德州仪器
25+
QFN
54658
百分百原装现货 实单必成
TI
三年内
QFN48
1983
只做原装正品
TI
23+
VQFN-32
21000
原装现货,下单发货,顺丰包邮
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
TI
22+
QFN
15000
只做原装正品假一赔十!正规渠道订货!
23+
TSSOP
7300
专注配单,只做原装进口现货

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