型号 功能描述 生产厂家 企业 LOGO 操作
CC2640R2FRSM

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU BLUETOOTH 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:托盘 描述:IC RF TXRX+MCU BLE 5.1 32VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU for Automotive

文件:1.36076 Mbytes Page:40 Pages

TI

德州仪器

更新时间:2025-12-30 20:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
100000
代理渠道/只做原装/可含税
TI/德州仪器
25+
VQFN32
32000
TI/德州仪器全新特价CC2640R2FRSMR即刻询购立享优惠#长期有货
TI
23+
VQFN-32
21000
原装现货,下单发货,顺丰包邮
TI(德州仪器)
24+
VQFN-32
8048
原厂可订货,技术支持,直接渠道。可签保供合同
TI
21+
NA
24000
全新原装公司现货
TI(德州仪器)
24+
VQFN-32
10048
原厂可订货,技术支持,直接渠道。可签保供合同
TI/德州仪器
24+
VQFN32
9000
只做全新原装进口现货
TI
24+
VQFN32
98671
专业代理蓝牙芯片原装现货
恩XP
2450+
QFN
9850
只做原装正品现货或订货假一赔十!
TI(德州仪器)
2526+
VQFN-32-EP(4x4)
3000
全新、原装

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