丝印代码：CC2640R2F；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

封装/外壳：32-VFQFN 裸露焊盘 包装：管件 描述：IC RF TXRX+MCU BLUETOOTH 32VFQFN RF/IF，射频/中频和 RFID 射频收发器 IC

SimpleLink Bluetooth low energy Wireless MCU

文件：1.97981 Mbytes Page：64 Pages

丝印代码：CC2640R2F；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

丝印代码：CC2640R2F；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

SimpleLink Bluetooth low energy Wireless MCU

文件：1.97981 Mbytes Page：64 Pages

SimpleLink Bluetooth low energy Wireless MCU

文件：1.97981 Mbytes Page：64 Pages

SimpleLink Bluetooth low energy Wireless MCU

文件：1.97981 Mbytes Page：64 Pages

SimpleLink Bluetooth low energy Wireless MCU

文件：1.97981 Mbytes Page：64 Pages