| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
CC1310 | CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 |   | |
CC1310 | CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | | |
CC1310 | CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | | |
CC1310 | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | | |
CC1310 | CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | | |
CC1310 | CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI 德州仪器 | | |
CC1310 | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | | |
CC1310 | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | | |
CC1310 | CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | | |
CC1310 | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | | |
CC1310 | Ultra Low Power sub 1GHz Multichannels Radio Transceiver Feature : IEEE 802.15.4g mode switch support Ultra Low consumption technology Powerful ARM Cortex M3 Supported by the open platform Contiki 6LoWPAN. Very Small size | ETCList of Unclassifed Manufacturers 未分类制造商 | | |
CC1310 | 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 低于 1GHz 无线 MCU | TI 德州仪器 | | |
CC1310 | CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件：2.90059 Mbytes Page：58 Pages | TI 德州仪器 | | |
CC1310 | CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件：3.51768 Mbytes Page：63 Pages | TI 德州仪器 | | |
CC1310 | SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | |
CC1310 SimpleLink Ultra-Low Power Sub-1 GHz Wireless MCU 文件：662.69 Kbytes Page：46 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
包装：散装 描述：BUNDLE SMARTRF06EBK/CC1310EMK 开发板，套件，编程器 射频评估和开发套件，开发板 | TI2 德州仪器 | | ||
包装：盒 描述：EVALUATION KIT CC1310 WIRELESS 开发板，套件，编程器 射频评估和开发套件，开发板 | TI2 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件：1.47595 Mbytes Page：54 Pages | TI 德州仪器 | | ||
200 V - 1,000 V Single Phase Bridge [VOLTAGE MULTIPLIERS INC.] 200 V - 1,000 V Single Phase Bridge 4.5 A - 5.0 A Forward Current 70 ns - 3000 ns Recovery Time | ETCList of Unclassifed Manufacturers 未分类制造商 | | ||
200 V - 1,000 V Single Phase Bridge 4.5 A - 5.0 A Forward Current 70 ns - 3000 ns Recovery Time 200 V - 1,000 V Single Phase Bridge 4.5 A - 5.0 A Forward Current 70 ns - 3000 ns Recovery Time | VMI | | ||
Speaker Cable, 4 C #14 Str BC-OFHC, PVC Jkt, CM, DIR BUR, Flexible Product Description Speaker Cable, 4 Conductor 14 AWG (105 x 34) Oxygen-Free Bare Copper (High Conductivity), PE Insulation, PVC Jacket, CM, Direct Burial, Flexible | BELDEN 百通 | | ||
Customer Specification Construction Diameters (In) 1) Component 1 16 X 1 PAIR a) Conductor 22 (SOLID) AWG Tinned Copper 0.025 b) Insulation 0.010 Wall, Nom. PVC, Semi Rigid 0.045 (1) Color Code Alpha Wire Color Code A Pair Color Pair Color Pair Color 1 BLACK-RED 7 BLACKORANGE 13 RED-ORANGE 2 BLACK-WHITE 8 RED- | ALPHAWIRE | | ||
200 V - 1,000 V Single Phase Bridge [VOLTAGE MULTIPLIERS INC.] 200 V - 1,000 V Single Phase Bridge 4.5 A - 5.0 A Forward Current 70 ns - 3000 ns Recovery Time | ETCList of Unclassifed Manufacturers 未分类制造商 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI/德州仪器 |
24+ |
VQFN48 |
30000 |
房间原装现货特价热卖,有单详谈 |
|||
TI |
24+ |
VQFN-32 |
8000 |
新到现货，只做全新原装正品 |
|||
TI(德州仪器) |
24+ |
VQFN48(7x7) |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
TI(德州仪器) |
24+ |
标准封装 |
7648 |
原厂直销,大量现货库存,交期快。价格优,支持账期 |
|||
TI/德州仪器 |
2023+ |
VQFN32 |
3000 |
十五年行业诚信经营,专注全新正品 |
|||
TI/德州仪器 |
22+ |
QFN |
100000 |
代理渠道/只做原装/可含税 |
|||
TI/德州仪器 |
25+ |
QFN-48 |
58788 |
百分百原装现货 实单必成 欢迎询价 |
|||
Texas Instruments |
24+ |
VQFN-48 |
3265 |
全新原厂原装，进口正品现货，正规渠道可含税！！ |
|||
TI/德州仪器 |
25+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
||||
TI |
21+ |
开发板 |
10000 |
全新原装现货 |
CC1310规格书下载地址
CC1310参数引脚图相关
- cw7805
- cs5532
- cs1
- cpld
- cp10
- connector
- cob
- cmos传感器
- cmos
- cm2006
- cicret
- cd4543
- cd4066
- cd4051
- cd4046
- cd4011
- CCFL
- ccd图像传感器
- ccd传感器
- CCD
- CC22K2
- CC2220
- CC20TTE
- CC2036
- CC2024
- CC2016B
- CC1V_16
- CC1-N
- CC1F_16
- CC1A_16
- CC1812
- CC1808
- CC-18
- CC154
- CC1512
- CC14633
- CC1352R
- CC1352P
- CC1350
- CC1312R
- CC1310F64RSMT
- CC1310F64RSMR
- CC1310F64RHBT
- CC1310F64RHBR
- CC1310F64RGZT
- CC1310F64RGZR
- CC1310F32RSMT
- CC1310F32RSMR
- CC1310F32RHBT
- CC1310F32RHBR
- CC1310F32RGZT
- CC1310F32RGZR
- CC1310F128RSMT
- CC1310F128RSMR
- CC1310F128RHBT
- CC1310F128RHBR
- CC1310F128RGZT
- CC1310F128RGZR
- CC1310_16
- CC1310_15
- CC13052
- CC12TTE
- CC-12SLASH50V
- CC12K2
- CC12H8A-TR
- CC12H8A
- CC12H7A-TR
- CC12H7A
- CC12H750mA-TR
- CC12H750mA
- CC12H6A-TR
- CC12H6A
- CC12H5A-TR
- CC12H5A
- CC12H500mA-TR
- CC12H500mA
- CC12H4A-TR
- CC12H4A
- CC12H4-5A-TR
- CC12H4.5A
- CC12H3A-TR
- CC12H3A
- CC12H2A
- CC12H1A
- CC12H
- CC1240R
- CC1216
- CC1210
- CC1206
- CC1201
- CC1200
- CC11K0
- CC1190
CC1310数据表相关新闻
CC1310F128RSMR
CC1310F128RSMR
2023-10-25CC1310F128RSMR 射频微控制器
CC1310F128RSMR 射频微控制器 - MCU 433 868 915 MHz ULP Wireless MCU
2023-2-23CC1190RGVR
进口代理
2023-1-13CC1310F128RHBR
CC1310F128RHBR
2021-8-30CC12H25A-TR
AECQ 1206贴片快速熔断保险丝– CC12H系列 伊顿的CC12H系列高I2t芯片保险丝已获得750 mA至30 A的AEC-Q200认证
2020-3-16CC1200RHBR公司进口原装现货/长期供应
瀚佳科技(深圳)有限公司 专业为工厂一站式BOM配单服务
2019-3-31
DdatasheetPDF页码索引
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