| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
CC1310 | CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | ||
CC1310 | CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | ||
CC1310 | CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1310 | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1310 | CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC1310 | CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI 德州仪器 | ||
CC1310 | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | ||
CC1310 | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI 德州仪器 | ||
CC1310 | CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | ||
CC1310 | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI 德州仪器 | ||
CC1310 | CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le | TI 德州仪器 | ||
CC1310 | CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | ||
CC1310 | CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag | TI 德州仪器 | ||
CC1310 | CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C | TI 德州仪器 | ||
CC1310 | CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU 1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le | TI 德州仪器 | ||
CC1310 | CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® | TI 德州仪器 | ||
CC1310 | Ultra Low Power sub 1GHz Multichannels Radio Transceiver Feature : IEEE 802.15.4g mode switch support Ultra Low consumption technology Powerful ARM Cortex M3 Supported by the open platform Contiki 6LoWPAN. Very Small size | ETCList of Unclassifed Manufacturers 未分类制造商 | ||
CC1310 | CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件:2.90059 Mbytes Page:58 Pages | TI 德州仪器 | ||
CC1310 | CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件:3.51768 Mbytes Page:63 Pages | TI 德州仪器 | ||
CC1310 | SimpleLink Ultralow Power Sub-1-GHz Wireless MCU 文件:1.47595 Mbytes Page:54 Pages | TI 德州仪器 | ||
CC1310 | 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 低于 1GHz 无线 MCU | TI 德州仪器 | ||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 | |||
CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka | TI 德州仪器 |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI(德州仪器) |
24+ |
标准封装 |
7648 |
原厂直销,大量现货库存,交期快。价格优,支持账期 |
|||
TI(德州仪器) |
24+ |
NA/ |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
ON/安森美 |
24+ |
SOT23 |
8168 |
公司现货库存,支持实单 |
|||
YEASHIN |
25+ |
SOT23-6 |
6000 |
原装正品,假一罚十! |
|||
TI/德州仪器 |
25+ |
VQFN48 |
32000 |
TI/德州仪器全新特价CC1310F128RGZR即刻询购立享优惠#长期有货 |
|||
TI |
23+ |
VQFN32 |
45000 |
常备现货,支持实单 |
|||
TI(德州仪器) |
24+ |
N/A |
6000 |
原厂原装,价格优势,欢迎洽谈! |
|||
TI |
23+ |
开发板 |
10000 |
正规渠道,只有原装! |
|||
TI(德州仪器) |
23+ |
NA |
20094 |
正纳10年以上分销经验原装进口正品做服务做口碑有支持 |
|||
TI |
23+ |
NA |
20000 |
CC1310规格书下载地址
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- CC1310F128RGZTG4.B
- CC1310F128RGZTG4
- CC1310F128RGZT.B
- CC1310F128RGZT
- CC1310F128RGZR.B
- CC1310F128RGZR
- CC1310F128RGZ
- CC1310_16
- CC1310_15
- CC13052
- CC12TTE
- CC-12SLASH50V
- CC12K2
- CC12H8A-TR
- CC12H8A
- CC12H7A-TR
- CC12H7A
- CC12H750mA-TR
- CC12H750mA
- CC12H6A-TR
- CC12H6A
- CC12H5A-TR
- CC12H5A
- CC12H500mA-TR
- CC12H500mA
- CC12H4A-TR
- CC12H4A
- CC12H4-5A-TR
- CC12H4.5A
- CC12H3A-TR
- CC12H3A
- CC12H2A
- CC12H1A
- CC12H
- CC1240R
- CC1216
- CC1210
- CC1206
- CC1201
- CC1200
- CC11K0
- CC1190
CC1310数据表相关新闻
CC1190RGVR 是德州仪器(TI)推出的Sub-1GHz 射频前端芯片,专为扩展 Sub-1GHz 无线系统的通信距离与性能而设计,
CC1190RGVR 是德州仪器(TI) 800000 PCS
2025-10-20CC1310F128RSMR
CC1310F128RSMR
2023-10-25CC1310F128RSMR 射频微控制器
CC1310F128RSMR 射频微控制器 - MCU 433 868 915 MHz ULP Wireless MCU
2023-2-23CC1310F128RHBR
CC1310F128RHBR
2021-8-30CC12H25A-TR
AECQ 1206贴片快速熔断保险丝– CC12H系列 伊顿的CC12H系列高I2t芯片保险丝已获得750 mA至30 A的AEC-Q200认证
2020-3-16CC1200RHBR公司进口原装现货/长期供应
瀚佳科技(深圳)有限公司 专业为工厂一站式BOM配单服务
2019-3-31
DdatasheetPDF页码索引
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