73M2901价格

参考价格:¥23.2285

型号:73M2901CE-IGV/F 品牌:Maxim 备注:这里有73M2901多少钱,2025年最近7天走势,今日出价,今日竞价,73M2901批发/采购报价,73M2901行情走势销售排行榜,73M2901报价。
型号 功能描述 生产厂家&企业 LOGO 操作
73M2901

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

TDK株式会社

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

TDK株式会社

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

TDK株式会社

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22 BIS SINGLE CHIP MODEM

DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as

TDK

TDK株式会社

V.22 BIS SINGLE CHIP MODEM

DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as

TDK

TDK株式会社

V.22 BIS SINGLE CHIP MODEM

DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as

TDK

TDK株式会社

V.22 BIS SINGLE CHIP MODEM

DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as

TDK

TDK株式会社

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

TDK株式会社

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

TDK株式会社

功能:调制解调器 包装:盒 描述:BOARD DEMO 73M2901CE WORLDWIDE 开发板,套件,编程器 评估和演示板及套件

AD

亚德诺

封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块

AD

亚德诺

73M2901产品属性

  • 类型

    描述

  • 型号

    73M2901

  • 制造商

    TDK

  • 制造商全称

    TDK Electronics

  • 功能描述

    Advanced Single Chip Modem

更新时间:2025-8-8 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Maxim(美信)
24+
标准封装
22366
原厂渠道供应,大量现货,原型号开票。
TDK
2016+
PLCC-32
1000
只做原装,假一罚十,公司可开17%增值税发票!
MAXIM
24+
TQFP32
80000
只做自己库存 全新原装进口正品假一赔百 可开13%增
MAXIM/美信
25+
QFP32
54658
百分百原装现货 实单必成
TDK/东电化
25+
PLCC
32360
TDK/东电化全新特价73M2901-32IH即刻询购立享优惠#长期有货
TDK
24+
PLCC
20000
全新原厂原装,进口正品现货,正规渠道可含税!!
MAXIM/美信
23+
TQFP-32
12700
买原装认准中赛美
TDK/东电化
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
MAXIM/美信
24+
TQFP-32
30000
原装正品公司现货,假一赔十!
TDK
25+
SOP
3200
全新原装、诚信经营、公司现货销售

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