型号 功能描述 生产厂家 企业 LOGO 操作
73M2901CE-IGVR/F

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

73M2901CE-IGVR/F

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

73M2901CE-IGVR/F

封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块

AD

亚德诺

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

东电化

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

73M2901CE-IGVR/F产品属性

  • 类型

    描述

  • 型号

    73M2901CE-IGVR/F

  • 功能描述

    电信线路管理 IC V.22bis Single-Chip Modem

  • RoHS

  • 制造商

    STMicroelectronics

  • 产品

    PHY

  • 接口类型

    UART

  • 电源电压-最大

    18 V

  • 电源电压-最小

    8 V

  • 电源电流

    30 mA

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 40 C

  • 安装风格

    SMD/SMT

  • 封装/箱体

    VFQFPN-48

  • 封装

    Tray

更新时间:2026-1-3 15:50:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MAXIM/美信
23+
QFP
98900
原厂原装正品现货!!
MAXIM/美信
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
Maxim(美信)
25+
TQFP-32
500000
源自原厂成本,高价回收工厂呆滞
MAXIM
22+
QFP
20000
公司只有原装 品质保证
MAXIM/美信
2025+
QFP
5000
原装进口价格优 请找坤融电子!
MAXIM/美信
20+
QFP
3000
现货很近!原厂很远!只做原装
MAXIM
18+
QFP
4300
一级代理,专注军工、汽车、医疗、工业、新能源、电力
MAXIM
原厂封装
9800
原装进口公司现货假一赔百
MAXIM/美信
24+
QFP
12876
只做原装 公司现货库存
MAXIM/美信
24+
QFP
60000
全新原装现货

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