型号 功能描述 生产厂家 企业 LOGO 操作
73M2901CE-IGVR/F

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

73M2901CE-IGVR/F

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

73M2901CE-IGVR/F

封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块

AD

亚德诺

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

东电化

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

73M2901CE-IGVR/F产品属性

  • 类型

    描述

  • 型号

    73M2901CE-IGVR/F

  • 功能描述

    电信线路管理 IC V.22bis Single-Chip Modem

  • RoHS

  • 制造商

    STMicroelectronics

  • 产品

    PHY

  • 接口类型

    UART

  • 电源电压-最大

    18 V

  • 电源电压-最小

    8 V

  • 电源电流

    30 mA

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 40 C

  • 安装风格

    SMD/SMT

  • 封装/箱体

    VFQFPN-48

  • 封装

    Tray

更新时间:2025-11-18 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Maxim(美信)
24+
标准封装
22366
原厂渠道供应,大量现货,原型号开票。
MAXIM/美信
24+
NA/
20
优势代理渠道,原装正品,可全系列订货开增值税票
MAXIM/美信
25+
QFP
996880
只做原装,欢迎来电资询
MAXIM
18+
QFP
4300
一级代理,专注军工、汽车、医疗、工业、新能源、电力
MAXIM/美信
24+
QFN-32
30000
原装正品公司现货,假一赔十!
MAXIM/美信
23+
QFN-32
12700
买原装认准中赛美
MAXIM/美信
24+
QFP
12876
只做原装 公司现货库存
MAXIM/美信
23+
QFP
98900
原厂原装正品现货!!
MAXIM
24+
NA
12500
只做原装正品现货 欢迎来电查询15919825718
MAXIM/美信
22+
QFP
12245
现货,原厂原装假一罚十!

73M2901CE-IGVR/F芯片相关品牌

73M2901CE-IGVR/F数据表相关新闻