型号 功能描述 生产厂家&企业 LOGO 操作
73M2901CE-IGVR/F

SingleChipModem

DESCRIPTION The73M2901CElowspeedmodemintegratesadatapump,controller,andanalogfrontendina3.3VdevicewithapowerfulATcommandhostinterface.Themodemreducesexternalcomponentcount/costbyincorporatingmanyfeatureslikeparallelphonedetect,Line-In-UseandRingdetect

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN
73M2901CE-IGVR/F

V.22bisSingleChipModem

DESCRIPTION The73M2901CElowspeedmodemintegratesadatapump,controller,andanalogfrontendina3.3VdevicewithapowerfulATcommandhostinterface.Themodemreducesexternalcomponentcount/costbyincorporatingmanyfeatureslikeparallelphonedetect,Line-In-UseandRingdetection

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN
73M2901CE-IGVR/F

封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块

ADAnalog Devices

亚德诺亚德诺半导体技术有限公司

AD

AdvancedSingleChipModem

DESCRIPTION The73M2901/5Visasingle-chipmodemthatcombinesallthecontroller(DTE)anddatapumpfunctionsnecessarytoimplementanintelligentV.22bisdatamodem.ThisdeviceisbasedonTDKSemiconductor’simplementationoftheindustrystandard8032microcontrollercorewithaproprie

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

SingleChipModem

DESCRIPTION The73M2901CElowspeedmodemintegratesadatapump,controller,andanalogfrontendina3.3VdevicewithapowerfulATcommandhostinterface.Themodemreducesexternalcomponentcount/costbyincorporatingmanyfeatureslikeparallelphonedetect,Line-In-UseandRingdetect

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN

V.22bisSingleChipModem

DESCRIPTION The73M2901CElowspeedmodemintegratesadatapump,controller,andanalogfrontendina3.3VdevicewithapowerfulATcommandhostinterface.Themodemreducesexternalcomponentcount/costbyincorporatingmanyfeatureslikeparallelphonedetect,Line-In-UseandRingdetection

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN

V.22bisSingleChipModem

DESCRIPTION The73M2901CElowspeedmodemintegratesadatapump,controller,andanalogfrontendina3.3VdevicewithapowerfulATcommandhostinterface.Themodemreducesexternalcomponentcount/costbyincorporatingmanyfeatureslikeparallelphonedetect,Line-In-UseandRingdetection

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN

SingleChipModem

DESCRIPTION The73M2901CElowspeedmodemintegratesadatapump,controller,andanalogfrontendina3.3VdevicewithapowerfulATcommandhostinterface.Themodemreducesexternalcomponentcount/costbyincorporatingmanyfeatureslikeparallelphonedetect,Line-In-UseandRingdetect

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN

73M2901CE-IGVR/F产品属性

  • 类型

    描述

  • 型号

    73M2901CE-IGVR/F

  • 功能描述

    电信线路管理 IC V.22bis Single-Chip Modem

  • RoHS

  • 制造商

    STMicroelectronics

  • 产品

    PHY

  • 接口类型

    UART

  • 电源电压-最大

    18 V

  • 电源电压-最小

    8 V

  • 电源电流

    30 mA

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 40 C

  • 安装风格

    SMD/SMT

  • 封装/箱体

    VFQFPN-48

  • 封装

    Tray

更新时间:2025-7-24 16:52:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Maxim(美信)
24+
标准封装
22366
原厂渠道供应,大量现货,原型号开票。
MAXIM/美信
24+
NA/
20
优势代理渠道,原装正品,可全系列订货开增值税票
MAXIM/美信
24+
QFN-32
6000
全新原装深圳仓库现货有单必成
MAXIM
2024
QFP
13500
16余年资质 绝对原盒原盘代理渠道 更多数量
MAXIM/美信
24+
QFN-32
30000
原装正品公司现货,假一赔十!
MAXIM/美信
23+
TQFP
5000
原厂授权代理,海外优势订货渠道。可提供大量库存,详
MAXIM
24+
NA
12500
只做原装正品现货 欢迎来电查询15919825718
MAXIM/美信
23+
QFP
98900
原厂原装正品现货!!
Maxim(美信)
2021+
6000
原装现货,欢迎询价
MAXIM/美信
24+
QFP
12876
只做原装 公司现货库存

73M2901CE-IGVR/F芯片相关品牌

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  • RHOMBUS-IND
  • TELEDYNE
  • YAMAICHI

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