型号 功能描述 生产厂家&企业 LOGO 操作
73M2901CE-IGVSLASHF

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN
73M2901CE-IGVSLASHF

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

TERIDIAN
更新时间:2025-8-6 13:24:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MAXIM/美信
23+
QFN-32
12700
买原装认准中赛美
MAXIM/美信
23+
QFN-32
6900
全新原装正品现货,支持订货
TDK
24+
TQFP64
2650
原装优势!绝对公司现货
MAXIM/美信
24+
QFN-32
6000
全新原装深圳仓库现货有单必成
MAXIM/美信
24+
QFN-32
30000
原装正品公司现货,假一赔十!
MAXIM/美信
23+
QFN-32
5000
全新原装现货
TERIDIAN
25+23+
QFP
22162
绝对原装正品全新进口深圳现货
TDK
24+
PLCC
496
TDK
24+
PLCC
3500
原装现货,可开13%税票
MAXIM/美信
2022+
QFN-32
6900
原厂原装,假一罚十

73M2901CE-IGVSLASHF芯片相关品牌

  • ANALOGICTECH
  • ASTRODYNE
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  • NTE
  • P-TEC
  • WECO
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