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型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
---|---|---|---|---|
73M2901CE-IGVSLASHF | V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection | TERIDIAN Teridian Semiconductor Corporation | ||
73M2901CE-IGVSLASHF | Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect | TERIDIAN Teridian Semiconductor Corporation | ||
Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect | TERIDIAN Teridian Semiconductor Corporation | |||
V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection | TERIDIAN Teridian Semiconductor Corporation | |||
V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection | TERIDIAN Teridian Semiconductor Corporation | |||
Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect | TERIDIAN Teridian Semiconductor Corporation |
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
MAXIM/美信 |
23+ |
QFN-32 |
12700 |
买原装认准中赛美 |
|||
MAXIM/美信 |
23+ |
QFN-32 |
6900 |
全新原装正品现货,支持订货 |
|||
TDK |
24+ |
TQFP64 |
2650 |
原装优势!绝对公司现货 |
|||
MAXIM/美信 |
24+ |
QFN-32 |
6000 |
全新原装深圳仓库现货有单必成 |
|||
MAXIM/美信 |
24+ |
QFN-32 |
30000 |
原装正品公司现货,假一赔十! |
|||
MAXIM/美信 |
23+ |
QFN-32 |
5000 |
全新原装现货 |
|||
TERIDIAN |
25+23+ |
QFP |
22162 |
绝对原装正品全新进口深圳现货 |
|||
TDK |
24+ |
PLCC |
496 |
||||
TDK |
24+ |
PLCC |
3500 |
原装现货,可开13%税票 |
|||
MAXIM/美信 |
2022+ |
QFN-32 |
6900 |
原厂原装,假一罚十 |
73M2901CE-IGVSLASHF规格书下载地址
73M2901CE-IGVSLASHF参数引脚图相关
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DdatasheetPDF页码索引
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