型号 功能描述 生产厂家&企业 LOGO 操作
73M2901CE-IMR/F

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE-IMR/F

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE-IMR/F

封装/外壳:32-VFQFN 裸露焊盘 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-QFN 集成电路(IC) 调制解调器 - IC 和模块

AD

亚德诺

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

TDK株式会社

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE-IMR/F产品属性

  • 类型

    描述

  • 型号

    73M2901CE-IMR/F

  • 功能描述

    电信线路管理 IC V.22bis Single-Chip Modem

  • RoHS

  • 制造商

    STMicroelectronics

  • 产品

    PHY

  • 接口类型

    UART

  • 电源电压-最大

    18 V

  • 电源电压-最小

    8 V

  • 电源电流

    30 mA

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 40 C

  • 安装风格

    SMD/SMT

  • 封装/箱体

    VFQFPN-48

  • 封装

    Tray

更新时间:2025-8-10 15:17:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TDK/东电化
24+
TQFP44
9600
原装现货,优势供应,支持实单!
MAXIM/美信
23+
QFN-32
5000
全新原装现货
Maxim Integrated
22+
NA
500000
万三科技,秉承原装,购芯无忧
TDK/东电化
2447
TQFP44
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
TDK
2022+
TQFP44
20000
只做原装进口现货.假一罚十
TDK
24+
PLCC
496
TDK
22+
TQFP44
20612
原装正品现货
TDK/东电化
21+
TQFP44
1120
TERIDIAN
0831+
QFP
4525
一级代理,专注军工、汽车、医疗、工业、新能源、电力
MAXIM/美信
2021+
QFN-32
6900

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