型号 功能描述 生产厂家&企业 LOGO 操作
73M2901CE-IMR/F

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE-IMR/F

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE-IMR/F

封装/外壳:32-VFQFN 裸露焊盘 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-QFN 集成电路(IC) 调制解调器 - IC 和模块

AD

亚德诺

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

TDK株式会社

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE-IMR/F产品属性

  • 类型

    描述

  • 型号

    73M2901CE-IMR/F

  • 功能描述

    电信线路管理 IC V.22bis Single-Chip Modem

  • RoHS

  • 制造商

    STMicroelectronics

  • 产品

    PHY

  • 接口类型

    UART

  • 电源电压-最大

    18 V

  • 电源电压-最小

    8 V

  • 电源电流

    30 mA

  • 最大工作温度

    + 85 C

  • 最小工作温度

    - 40 C

  • 安装风格

    SMD/SMT

  • 封装/箱体

    VFQFPN-48

  • 封装

    Tray

更新时间:2025-8-7 20:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TERIDIAN
24+
NA/
7775
原装现货,当天可交货,原型号开票
TDK/东电化
24+
TQFP44
880000
明嘉莱只做原装正品现货
Teridian
1715+
SOP
251156
只做原装正品现货假一赔十!
TDK/东电化
21+
TQFP44
1120
TERIDIAN
0831+
QFP
4525
一级代理,专注军工、汽车、医疗、工业、新能源、电力
MAXIM/美信
24+
QFN-32
6000
全新原装深圳仓库现货有单必成
MAXIM
24+
NA
12500
只做原装正品现货 欢迎来电查询15919825718
MAXIM/美信
23+
QFN-32
12700
买原装认准中赛美
MAXIM/美信
24+
QFN-32
30000
原装正品公司现货,假一赔十!
TDK
24+
PLCC
3500
原装现货,可开13%税票

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