73M2901CE价格

参考价格:¥23.2285

型号:73M2901CE-IGV/F 品牌:Maxim 备注:这里有73M2901CE多少钱,2025年最近7天走势,今日出价,今日竞价,73M2901CE批发/采购报价,73M2901CE行情走势销售排行榜,73M2901CE报价。
型号 功能描述 生产厂家 企业 LOGO 操作
73M2901CE

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE

V.22bis单芯片调制解调器

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亚德诺

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

东电化

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

功能:调制解调器 包装:盒 描述:BOARD DEMO 73M2901CE WORLDWIDE 开发板,套件,编程器 评估和演示板及套件

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亚德诺

封装/外壳:32-TQFP 包装:管件 描述:IC MODEM 3.3V V.22BIS 32-TQFP 集成电路(IC) 调制解调器 - IC 和模块

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亚德诺

73M2901CE产品属性

  • 类型

    描述

  • 型号

    73M2901CE

  • 制造商

    TERIDIAN

  • 制造商全称

    TERIDIAN

  • 功能描述

    Single Chip Modem

更新时间:2025-9-25 18:49:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MAXIM
1035+
32-QFN
20
一级代理,专注军工、汽车、医疗、工业、新能源、电力
Maxim(美信)
23+
标准封装
6000
原厂原装现货订货价格优势终端BOM表可配单提供样品
MAXIM/美信
25+
QFP32
54658
百分百原装现货 实单必成
MAXIM
原厂封装
9800
原装进口公司现货假一赔百
TERIDIAN
23+
QFP32
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
MAXIM
23+
32-QFN
2520
原厂原装正品
MAXIM/美信
25+
原厂封装
10280
原厂授权一级代理,专注军工、汽车、医疗、工业、新能源、电力!
TERIDIAN
2450+
TQFP32
8850
只做原装正品假一赔十为客户做到零风险!!
TERIDIAN
2024
TQFP32
55200
16余年资质 绝对原盒原盘代理渠道 更多数量
TERIDIAN
25+
TQFP32
880000
明嘉莱只做原装正品现货

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