型号 功能描述 生产厂家 企业 LOGO 操作
73M2901CE-IGVRSLASHF

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

73M2901CE-IGVRSLASHF

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Advanced Single Chip Modem

DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie

TDK

东电化

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

V.22bis Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection

TERIDIAN

Teridian Semiconductor Corporation

Single Chip Modem

DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect

TERIDIAN

Teridian Semiconductor Corporation

更新时间:2025-9-25 18:49:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MAXIM
1035+
32-QFN
20
一级代理,专注军工、汽车、医疗、工业、新能源、电力
MAXIM
原厂封装
9800
原装进口公司现货假一赔百
MAXIM
23+
32-QFN
2520
原厂原装正品
Maxim Integrated
24+
32-QFN(5x5)
56200
一级代理/放心采购
TDK
24+
PLCC
3500
原装现货,可开13%税票
TDK
24+
PLCC
496
MAXIM
24+
NA
12500
只做原装正品现货 欢迎来电查询15919825718
MAXIM/美信
23+
QFN-32
5000
全新原装现货
MAXIM/美信
23+
QFN-32
12700
买原装认准中赛美
TDK
25+
TQFP64
2650
原装优势!绝对公司现货

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