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73M2价格

参考价格：￥23.2285

型号：73M2901CE-IGV/F 品牌：Maxim 备注：这里有73M2多少钱，2025年最近7天走势，今日出价，今日竞价，73M2批发/采购报价，73M2行情走势销售排行榜，73M2报价。

型号	功能描述	生产厂家企业	LOGO
73M2	Metal Plate Current Sensing Resistors 文件：141.21 Kbytes Page：2 Pages	CTS 西迪斯	CTS
73M2	Speciality Resistors Current Sense Resistors	CTS 西迪斯	CTS
73M2901	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-32I3	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-32IH	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901CE	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE_V01	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CEIGV	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGV/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGV/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IGVR/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGVR/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IGVRSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IGVRSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGVSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGVSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IM/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IM/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IMR/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IMR/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IMRSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IMRSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IMSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IMSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CL	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIGT	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIGV	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIH	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901-IG3	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-IGT	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M223	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M223-CL	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M223-CP	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M2901CE	V.22bis单芯片调制解调器	AD 亚德诺	AD
73M2901CE-EVM-WW	功能：调制解调器包装：盒描述：BOARD DEMO 73M2901CE WORLDWIDE 开发板，套件，编程器评估和演示板及套件	AD 亚德诺	AD
73M2901CE-IGV/F	封装/外壳：32-TQFP 包装：管件描述：IC MODEM 3.3V V.22BIS 32-TQFP 集成电路（IC）调制解调器 - IC 和模块	AD 亚德诺	AD
73M2910L	Microcontroller 文件：572.27 Kbytes Page：35 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2921	Advanced Single Chip Modem 文件：222.72 Kbytes Page：41 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2921	Advanced Single Chip Modem	TDK 东电化	TDK
73M2921-IG	Advanced Single Chip Modem 文件：222.72 Kbytes Page：41 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2AR00025F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2AR0015F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2AR100F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R005F	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R005G	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R100F	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R100G	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
RL73M2A	SMD Low Ohmic ??Current Sense Resistors 文件：738.38 Kbytes Page：8 Pages	TEC 泰科电子	TEC
RL73M2B	SMD Low Ohmic ??Current Sense Resistors 文件：738.38 Kbytes Page：8 Pages	TEC 泰科电子	TEC
RLP73M2A	SMD Low Ohmic ??Current Sense Resistors 文件：738.38 Kbytes Page：8 Pages	TEC 泰科电子	TEC
RLP73M2A	Up to 2 Watts at 70째C 文件：177.19 Kbytes Page：5 Pages	MACOM	MACOM

73M2产品属性

类型
描述
型号
73M2
制造商
CTS
制造商全称
CTS Corporation
功能描述
Metal Plate Current Sensing Resistors

73M2供应商更多...

更新时间：2025-12-27 13:10:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市向鸿伟业电子有限公司	73M2901	TERIDIAN	2403+	QFP	6489	原装现货热卖!十年芯路!坚持!	询价
深圳市福田区亿兴成电子商行	73M2901	TDK			536		询价
深圳市恒达亿科技有限公司	73M223-CP	TDK	25+	DIP16	3000	全新原装、诚信经营、公司现货销售	询价
深圳市腾亿芯科技有限公司	73M2901CE-IGVR/F	MAXIM/美信	25+	QFP	13800	原装,请咨询	询价
深圳市威雅利发展有限公司	73M214A-IP	TDK	9643	DIP	25	一级代理,专注军工、汽车、医疗、工业、新能源、电力	询价
深圳市纳艾斯科技有限公司	73M214A-IP	TDK	24+	DIP	80000	只做自己库存全新原装进口正品假一赔百可开13%增	询价
中天科工半导体（深圳）有限公司	73M2901-32IH	TDK/东电化	25+	PLCC	32360	TDK/东电化全新特价73M2901-32IH即刻询购立享优惠#长期有货	询价
贸泽芯城（深圳）电子科技有限公司	73M223-CL	TDK/东电化	23+	SOP16	5000	原厂授权代理,海外优势订货渠道。可提供大量库存,详	询价
深圳市坤融电子科技有限公司	73M2901CE-IGVR/F	MAXIM/美信	2025+	QFP	5000	原装进口价格优请找坤融电子!	询价
深圳市明嘉莱科技有限公司	73M2901CE-IGV/F	MAXIM/美信	22+	明嘉莱只做原装正品现货	2510000	TQFP-32	询价

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73M2价格

73M2产品属性

73M2供应商更多...

73M2芯片相关品牌

73M2规格书下载地址

73M2参数引脚图相关

73M2数据表相关新闻

74270191铁氧体磁芯

739W-X2/32-A

7311

74088820APSE-QAA

74270034

73105

DdatasheetPDF页码索引