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73M2价格

参考价格：￥23.2285

型号：73M2901CE-IGV/F 品牌：Maxim 备注：这里有73M2多少钱，2025年最近7天走势，今日出价，今日竞价，73M2批发/采购报价，73M2行情走势销售排行榜，73M2报价。

型号	功能描述	生产厂家企业	LOGO
73M2	Metal Plate Current Sensing Resistors 文件：141.21 Kbytes Page：2 Pages	CTS 西迪斯	CTS
73M2	Speciality Resistors Current Sense Resistors	CTS 西迪斯	CTS
73M2901	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-32I3	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-32IH	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901CE	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE_V01	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CEIGV	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IGV/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IGV/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IGVR/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IGVR/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IGVRSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IGVRSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IGVSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IGVSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IM/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IM/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IMR/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IMR/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IMRSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IMRSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IMSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CE-IMSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN Teridian Semiconductor Corporation	TERIDIAN
73M2901CL	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIGT	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIGV	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIH	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901-IG3	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-IGT	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M223	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M223-CL	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M223-CP	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M2901CE	V.22bis单芯片调制解调器	AD 亚德诺	AD
73M2901CE-EVM-WW	功能：调制解调器包装：盒描述：BOARD DEMO 73M2901CE WORLDWIDE 开发板，套件，编程器评估和演示板及套件	AD 亚德诺	AD
73M2901CE-IGV/F	封装/外壳：32-TQFP 包装：管件描述：IC MODEM 3.3V V.22BIS 32-TQFP 集成电路（IC）调制解调器 - IC 和模块	AD 亚德诺	AD
73M2910L	Microcontroller 文件：572.27 Kbytes Page：35 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2910L	Microcontroller	TDK 东电化	TDK
73M2921	Advanced Single Chip Modem 文件：222.72 Kbytes Page：41 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2921-IG	Advanced Single Chip Modem 文件：222.72 Kbytes Page：41 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2AR00025F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2AR0015F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2AR100F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R005F	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R005G	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R100F	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R100G	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
RL73M2A	SMD Low Ohmic ??Current Sense Resistors 文件：738.38 Kbytes Page：8 Pages	TEC 泰科电子	TEC
RL73M2B	SMD Low Ohmic ??Current Sense Resistors 文件：738.38 Kbytes Page：8 Pages	TEC 泰科电子	TEC
RLP73M2A	Up to 2 Watts at 70째C 文件：177.19 Kbytes Page：5 Pages	MACOM	MACOM
RLP73M2A	SMD Low Ohmic ??Current Sense Resistors 文件：738.38 Kbytes Page：8 Pages	TEC 泰科电子	TEC

73M2产品属性

类型
描述
型号
73M2
制造商
CTS
制造商全称
CTS Corporation
功能描述
Metal Plate Current Sensing Resistors

73M2供应商更多...

更新时间：2025-10-8 14:04:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市坤融电子科技有限公司	73M2901-32IH	TDK	24+	PLCC	5000	原厂授权代理价格绝对优势	询价
深圳市豪迈兴电子有限公司	73M2910L-IG	TDK	24+	QFP	25843	公司原厂原装现货假一罚十!特价出售!强势库存!	询价
深圳市英特法电子科技有限公司	73M2901CE-IGV/F	MAXIM/美信	2023+	TQFP-32	6000	原装正品现货、支持第三方检验、终端BOM表可配单提供	询价
深圳市瑞祥辉半导体有限公司	73M2901C-IH	TDK/东电化	2318+	PLCC	4852	十年专业专注优势渠道商正品保证公司现货	询价
深圳市昌和盛利电子有限公司	73M2910-IG	IDT	NEW	QFP-100	9526	代理全系列销售,全新原装正品,价格优势,长期供应,量大可订	询价
深圳市欧立现代科技有限公司	73M2901-32IH	TDK	24+	PLCC	3500	原装现货,可开13%税票	询价
深圳市力仕科电子科技有限公司	73M2901CE-IGV/F	MAXIM/美信	25	TQFP-32	6000	原装正品	询价
深圳市卓越微芯电子有限公司	73M2901CE-IGV/F	MAXIM/T	25+	TQFP32	14	百分百原装正品真实公司现货库存本公司只做原装可	询价
深圳市汇莱威科技有限公司	73M2901CLIGV	TERIDIAN	2024	QFP	58209	16余年资质绝对原盒原盘代理渠道更多数量	询价
深圳市科恒伟业电子有限公司	73M2901CE-IGV/F	TERIDIAN	2450+	TQFP32	8850	只做原装正品假一赔十为客户做到零风险!!	询价

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73M2价格

73M2产品属性

73M2供应商更多...

73M2芯片相关品牌

73M2规格书下载地址

73M2参数引脚图相关

73M2数据表相关新闻

74270191铁氧体磁芯

739W-X2/32-A

7311

74088820APSE-QAA

74270034

73105

DdatasheetPDF页码索引