73M2规格书应用电路西迪斯原装现货专卖CTS-IC资料网

找IC，尽在114IC

登录注册

芯片资料

芯片资料
丝印反查
库存查询
行业新闻
制造商
替换型号
晶体管

精确

位置：首页 > IC中文资料第12559页 > 73M2

73M2价格

参考价格：￥23.2285

型号：73M2901CE-IGV/F 品牌：Maxim 备注：这里有73M2多少钱，2026年最近7天走势，今日出价，今日竞价，73M2批发/采购报价，73M2行情走势销售排行榜，73M2报价。

型号	功能描述	生产厂家企业	LOGO
73M2	Metal Plate Current Sensing Resistors 文件：141.21 Kbytes Page：2 Pages	CTS 西迪斯	CTS
73M2	Speciality Resistors Current Sense Resistors	CTS 西迪斯	CTS
73M2901	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-32I3	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-32IH	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901CE	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE_V01	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CEIGV	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGV/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IGV/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGVR/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGVR/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IGVRSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IGVRSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGVSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IGVSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IM/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IM/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IMR/F	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IMR/F	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IMRSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CE-IMRSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IMSLASHF	V.22bis Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detection	TERIDIAN	TERIDIAN
73M2901CE-IMSLASHF	Single Chip Modem DESCRIPTION The 73M2901CE low speed modem integrates a data pump, controller, and analog front end in a 3.3 V device with a powerful AT command host interface. The modem reduces external component count/cost by incorporating many features like parallel phone detect, Line-In-Use and Ring detect	TERIDIAN	TERIDIAN
73M2901CL	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIGT	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIGV	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901CLIH	V.22 BIS SINGLE CHIP MODEM DESCRIPTION The 73M2901CL is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. It is adequately suited for embedded applications where a data return channel is needed through the telephone network such as	TDK 东电化	TDK
73M2901-IG3	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M2901-IGT	Advanced Single Chip Modem DESCRIPTION The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprie	TDK 东电化	TDK
73M223	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M223-CL	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M223-CP	1200 Baud FSK Modem 文件：45.64 Kbytes Page：6 Pages	TDK 东电化	TDK
73M2901CE	V.22bis单芯片调制解调器	AD 亚德诺	AD
73M2901CE-EVM-WW	功能：调制解调器包装：盒描述：BOARD DEMO 73M2901CE WORLDWIDE 开发板，套件，编程器评估和演示板及套件	AD 亚德诺	AD
73M2901CE-IGV/F	封装/外壳：32-TQFP 包装：管件描述：IC MODEM 3.3V V.22BIS 32-TQFP 集成电路（IC）调制解调器 - IC 和模块	AD 亚德诺	AD
73M2910L	Microcontroller 文件：572.27 Kbytes Page：35 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2910L	Microcontroller	TDK 东电化	TDK
73M2921	Advanced Single Chip Modem 文件：222.72 Kbytes Page：41 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2921-IG	Advanced Single Chip Modem 文件：222.72 Kbytes Page：41 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
73M2AR00025F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2AR0015F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2AR100F	Metal Plate Construction ??Copper Alloy 文件：227.55 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R005F	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R005G	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R100F	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
73M2R100G	Current Sensing Resistors ??Metal Plate 文件：166.08 Kbytes Page：3 Pages	CTS 西迪斯	CTS
RLP73M2A	Values down to R10 文件：177.19 Kbytes Page：5 Pages	TEC 泰科电子	TEC
RLP73M2A	Up to 2 Watts at 70째C 文件：177.19 Kbytes Page：5 Pages	MACOM	MACOM
RLP73M2B	Up to 2 Watts at 70째C 文件：177.19 Kbytes Page：5 Pages	MACOM	MACOM
RLP73M2B	Values down to R10 文件：177.19 Kbytes Page：5 Pages	TEC 泰科电子	TEC

73M2产品属性

类型
描述
型号
73M2
制造商
CTS
制造商全称
CTS Corporation
功能描述
Metal Plate Current Sensing Resistors

73M2供应商更多...

更新时间：2026-3-17 23:00:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市高捷芯城科技有限公司	73M2901CE-IGVR/F	Maxim(美信)	24+	标准封装	22366	原厂渠道供应,大量现货,原型号开票。	询价
深圳市凌旭科技有限公司	73M2901-32IH	SIPEX	2016+	PLCC	8760	只做原装,假一罚十,公司可开17%增值税发票!	询价
上海意淼电子科技有限公司	73M223-CP	tdk	23+	NA	5000	全新原装假一赔十	询价
深圳市纳艾斯科技有限公司	73M214A-IP	TDK	24+	DIP	80000	只做自己库存全新原装进口正品假一赔百可开13%增	询价
中天科工半导体（深圳）有限公司	73M2901-32IH	TDK/东电化	25+	PLCC	32360	TDK/东电化全新特价73M2901-32IH即刻询购立享优惠#长期有货	询价
深圳市科芯源微电子有限公司	73M223-CL	TDK/东电化	2026+	SOP16	54658	百分百原装现货实单必成	询价
深圳市河锋鑫科技有限公司	73M2901CL-IH	TDK(东电化)	2021/2022+	标准封装	40000	原厂原装现货订货价格优势终端BOM表可配单提供样品	询价
深圳市中飞凌科技有限公司	73M2901CL-IH	TDK(东电化)	26+	SMD	360000	原厂原装,可配单	询价
深圳市威雅利发展有限公司	73M214A-IP	TDK	9643	DIP	25	一级代理,专注军工、汽车、医疗、工业、新能源、电力	询价
深圳市创盛芯科技有限公司	73M223-CP	TDK/东电化	25+	DIP16	1	全新原装正品支持含税	询价

73M2芯片相关品牌

73M2规格书下载地址

73M2参数引脚图相关

73M2数据表相关新闻

74270191铁氧体磁芯
Würth Elektronik 的铁氧体电缆芯由多种不同类型和等级的材料制成，包括镍锌
2024-4-11
739W-X2/32-A
739W-X2/32-A
2023-6-27
7311
优势渠道
2023-3-22
74088820APSE-QAA
74088820APSE-QAA
2021-9-9
74270034
74270034
2021-3-1
73105
73105 绝缘 BNC (M) 分线到悬空引线接头
2019-12-19

DdatasheetPDF页码索引

P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P30
P31
P32
P33
P34
P35
P36
P37
P38
P39
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P50
P51
P52
P53
P54
P55
P56
P57
P58
P59
P60
P61
P62
P63
P64
P65
P66
P67
P68
P69
P70
P71
P72
P73
P74
P75
P76
P77
P78
P79
P80
P81
P82
P83
P84
P85
P86
P87
P88
P89
P90
P91
P92
P93
P94
P95
P96
P97
P98
P99
P100
P101
P102
P103
P104
P105
P106
P107
P108

找IC，尽在114IC

73M2价格

73M2产品属性

73M2供应商更多...

73M2芯片相关品牌

73M2规格书下载地址

73M2参数引脚图相关

73M2数据表相关新闻

74270191铁氧体磁芯

739W-X2/32-A

7311

74088820APSE-QAA

74270034

73105

DdatasheetPDF页码索引