35A 5/16 TIN CAN TYPE PRESS-FIT DIODE

Features ● Glass Passivated Die Construction ● Low Leakage ● Low Cost ● High Surge Current Capability ● Typical IR less than 10µA

35A GLASS PASSIVATED 5/16” TIN CAN PRESS-FIT DIODE

Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Typical IR less than 5.0μA

SURFACE MOUNT THYRISTOR SURGE PROTECTIVE DEVICE

Bi-Directional VDRM - 58 to 320 Volts IPP - 100 Amperes FEATURES ● Oxide Glass Passivated Junction ● Bidirectional protection in a single device ● Surge capabilities up to 100A @ 10/1000us or 400 @ 8/20us ● High off state Impedance and low on state voltage ● Plastic material has UL flammab

35A 5/16 TIN CAN TYPE PRESS-FIT DIODE

Features ● Glass Passivated Die Construction ● Low Leakage ● Low Cost ● High Surge Current Capability ● Typical IR less than 10µA

35A GLASS PASSIVATED 5/16” TIN CAN PRESS-FIT DIODE

Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Typical IR less than 5.0μA

35A 5/16 TIN CAN TYPE PRESS-FIT DIODE

Features ● Glass Passivated Die Construction ● Low Leakage ● Low Cost ● High Surge Current Capability ● Typical IR less than 10µA

35A GLASS PASSIVATED 5/16” TIN CAN PRESS-FIT DIODE

Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Typical IR less than 5.0μA

35A 5/16 TIN CAN TYPE PRESS-FIT DIODE

Features ● Glass Passivated Die Construction ● Low Leakage ● Low Cost ● High Surge Current Capability ● Typical IR less than 10µA

35A GLASS PASSIVATED 5/16” TIN CAN PRESS-FIT DIODE

Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Typical IR less than 5.0μA

35A 5/16 TIN CAN TYPE PRESS-FIT DIODE

Features ● Glass Passivated Die Construction ● Low Leakage ● Low Cost ● High Surge Current Capability ● Typical IR less than 10µA

35A GLASS PASSIVATED 5/16” TIN CAN PRESS-FIT DIODE

Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Typical IR less than 5.0μA

35A GLASS PASSIVATED 5/16” TIN CAN PRESS-FIT DIODE

Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Typical IR less than 5.0μA

35A GLASS PASSIVATED 5/16” TIN CAN PRESS-FIT DIODE

Glass Passivated Die Construction Low Leakage Low Cost High Surge Current Capability Typical IR less than 5.0μA

10-BIT SERIAL I/O A/D CONVERTER

GENERAL DESCRIPTION The TC35080P is a high precision, high speed monolithic CMOS 10-bit Successive Approximation A/D Converter with separate serial input and output.

10-BIT A-D CONVERTER

GENERAL DESCRIPTION The TC35083P/F is a high precision, and high speed monolithic CMOS 10-bit successive approximation A-D converter with a 10-bit parallel output or an 8-bit time sharing output. It has a 2 channel analog multiplexer input. Conversion data may be output in any of there forms depe

10-BIT A-D CONVERTER

GENERAL DESCRIPTION The TC35083P/F is a high precision, and high speed monolithic CMOS 10-bit successive approximation A-D converter with a 10-bit parallel output or an 8-bit time sharing output. It has a 2 channel analog multiplexer input. Conversion data may be output in any of there forms depe

STANDARD SHAFT SEALS

DESCRIPTION The TC profile is a shaft seal composed of a single metal cage with a rubber coating, a primary sealing lip with integrated spring and an additional anti-pollution lip. APPLICATIONS Shaft sealing Engines Pumps Transmissions

STANDARD SHAFT SEALS

DESCRIPTION The TC profile is a shaft seal composed of a single metal cage with a rubber coating, a primary sealing lip with integrated spring and an additional anti-pollution lip. APPLICATIONS Shaft sealing Engines Pumps Transmissions

35A GLASS PASSIVATED AVALANCHE 5/16 TIN CAN PRESS-FIT DIODE

Features ● Glass Passivated Die Construction ● Low Leakage ● Low Cost ● High Surge Current Capability ● Typical IR less than 200nA

35A GLASS PASSIVATED AVALANCHE 5/16 TIN CAN PRESS-FIT DIODE

Features ● Glass Passivated Die Construction ● Low Leakage ● Low Cost ● High Surge Current Capability ● Typical IR less than 200nA

MPEG-4 Audiovisual LSI

Features □ TC35273 is an MPEG-4 audiovisual codec LSI which supports 3GPP 3G-324M video telephony system. MPEG-4 video codec with QCIF (176x144 pixel) at 15 frames/s, AMR (Adaptive Multi Rate) speech codec, and ITU-T H.223 are executed concurrently at around 70MHz clock rate. □ Three signal proc

TOSHIBA MPEG-4 Video Decoder LSI

MPEG-4 Video Decoder LSI Features □ A single-chip MPEG-4 video decoder LSI performs 15frames/sec of MPEG-4 video decoding with QCIF (176x144 pixels) at 30MHz clock frequency. □ A 4-Mbit embedded DRAM is integrated to reduce power consumption without performance degradation. □ An MPEG-4 video c

5.8 GHz 1W MMIC

DESCRIPTION The TC3531 is a 2 stage PHEMT MMIC power amplifier. It is designed for use in low cost and high volume 5.7-5.9 GHz band applications. The MMIC is matched to 50 Ω operation. No external matching component is required. It provides a typical gain of 24 dB and P1 dB power of 30 dBm. Typic

4.9 - 6 GHz 29dBm Single-Bias MMIC

DESCRIPTION The TC3532 is a 2-stage PHEMT MMIC power amplifier with single-bias. It requires only a single positive supply. It is designed for use in low cost and high volume 4.9~6 GHz band applications. The MMIC is matched to 50Ω operation. No external matching component is required. It provides

4.9 - 6 GHz 29dBm MMIC

[TRANSCOM, INC.] DESCRIPTION The TC3532 is a 2 stage PHEMT MMIC power amplifier. It is designed for use in low cost, high volume, 4.9~6 GHz band applications. The MMIC is matched to 50Ω operation. No external matching component is required. It provides a typical gain of 21 dB and P1dB power of

5-6 GHz 1W MMIC

[TRANSCOM, INC.] DESCRIPTION The TC3538 is a 2 stage PHEMT MMIC power amplifier. It is designed for use in low cost, high volume, 5 - 6 GHz band applications. The MMIC is matched to 50Ω operation. It provides a typical gain of 21 dB and P1dB power of more than 30 dBm. Typical bias condition is 7

5 - 6 GHz 1W MMIC

DESCRIPTION The TC3538 is a 2-stage PHEMT MMIC power amplifier. It is designed for use in low cost, high volume, 5 - 6 GHz band applications. The MMIC is matched to 50Ω operation. It provides a typical gain of 21 dB and P1dB power of more than 30 dBm. Typical bias condition is 7V at 600 mA. The M

4.8 - 6 GHz 29dBm Self-Bias MMIC

DESCRIPTION The TC3539 is a 2-stage PHEMT MMIC power amplifier. It requires only a single positive supply. It is designed for use in low cost, high volume, 4.8 - 6 GHz band applications. The MMIC is matched to 50Ω operation. It provides a typical gain of 19 dB and P1dB power of more than 29 dBm.

5.2 - 5.9 GHz 2W Single Bias MMIC

DESCRIPTION The TC3541 is a 2-stage PHEMT Single Bias MMIC power amplifier. It is designed for use in low cost and high volume 5.2~5.9 GHz band applications. The MMIC is matched to 50Ω operation. It provides a typical gain of 20 dB and P1dB power of 33 dBm. Typical bias condition is 9V at 1000

TC35661SBG-551 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-551 is TC35661 with ROM version 551. It supports both SPP (Serial Port P

TC35661SBG/DBG-203 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-203 is TC35661 with ROM version 203. It supports SPP (Serial Port Profil

TC35661SBG/DBG-503 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-503 is TC35661 with ROM version 503. It supports both SPP (Serial Port P

TC35661SBG/DBG-203 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-203 is TC35661 with ROM version 203. It supports SPP (Serial Port Profil

TC35661SBG/DBG-503 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-503 is TC35661 with ROM version 503. It supports both SPP (Serial Port P

TC35661IDBG-203 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-203 is TC35661 with ROM version 203. It supports SPP (Serial Port Profil

TC35661IDBG-503 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-503 is TC35661 with ROM version 503. It supports both SPP (Serial Port P

TC35661IDBG-009 Bluetooth® HCI IC

1. General Description 1.1. Product Concept TC35661IDBG-009 is a 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. TC35661 provides Bluetooth® HCI (Host Control Interface) function specified in Bluetooth® Core Specifications, EDR function

TC35661IDBG-203 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-203 is TC35661 with ROM version 203. It supports SPP (Serial Port Profil

TC35661IDBG-503 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-503 is TC35661 with ROM version 503. It supports both SPP (Serial Port P

TC35661SBG/DBG-503 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-503 is TC35661 with ROM version 503. It supports both SPP (Serial Port P

TC35661SBG-551 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-551 is TC35661 with ROM version 551. It supports both SPP (Serial Port P

TC35661SBG/DBG-203 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-203 is TC35661 with ROM version 203. It supports SPP (Serial Port Profil

TC35661SBG-009 Bluetooth® HCI IC

1. General Description 1.1. Product Concept TC35661SBG-009 is a 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. TC35661 provides Bluetooth® HCI (Host Control Interface) function specified in Bluetooth® Core Specifications, EDR function,

TC35661SBG/DBG-203 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-203 is TC35661 with ROM version 203. It supports SPP (Serial Port Profil

TC35661SBG-501 Bluetooth™ IC Embedded Profile Series

1. General Description 1.1 Product Concept TC35661SBG-501 is a 1-chip CMOS LSI for Bluetooth™ communication, which includes an RF analog part and a Base band digital part. TC35661 provides Bluetooth™ SPP (Serial Port Profile) function, GATT(Generic Attribute Profile) function, and LE(Low Energ

TC35661SBG/DBG-503 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-503 is TC35661 with ROM version 503. It supports both SPP (Serial Port P

TC35661SBG-551 Bluetooth® IC ROM Profile Series

1. General Description 1.1. Product Concept TC35661 is the 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital part. Each supported function depends on ROM version. TC35661-551 is TC35661 with ROM version 551. It supports both SPP (Serial Port P

TC35667FTG-006 TC35667FSG-006 Bluetooth® LE Single IC

1. General Description 1.1. Product Concept TC35667FTG-006 and TC35667FSG-006 (Later omitted TC35667.) is compliant with 2.4 GHz wireless communication Bluetooth® V4.1 low energy standard. With RF analog part and Baseband digital part built-in, TC35667 provides Bluetooth® HCI (Host Control Int

TC35667FTG Bluetooth® LE Single IC For Bluetooth® Smart

1 General Description 1.1. Product Concept TC35667FTG is IC based on a 2.4 GHz wireless-communications Bluetooth™ V4.0 Low Energy standard, which includes an RF analog part and a Baseband digital part. TC35667FTG provides Bluetooth™ HCI (Host Control Interface) function and LE (Low Energy) fun

TC35667FTG-006 TC35667FSG-006 Bluetooth® LE Single IC

1. General Description 1.1. Product Concept TC35667FTG-006 and TC35667FSG-006 (Later omitted TC35667.) is compliant with 2.4 GHz wireless communication Bluetooth® V4.1 low energy standard. With RF analog part and Baseband digital part built-in, TC35667 provides Bluetooth® HCI (Host Control Int

TC35670FTG Bluetooth™ LE NFC-Tag IC

1. General Description 1.1. Product Concept TC35670FTG is IC based on a 2.4GHz wireless-communications BluetoothTM V4.0 Low Energy standard, and has a built-in non-volatile memory (EEPROM) which can be accessed by communication based on NFC Forum Type 3 Tag standard. It includes an RF analog p

TC35670FTG-006 Bluetooth® Smart NFC Tag IC

1. General Description 1.1. Product Concept TC35670FTG-006(Later omitted TC35670FTG.) is compliant with 2.4 GHz wireless communication Bluetooth®V4.1 Low Energy standard and has functions of NFC Forum Type 3 Tag (NFC Tag) equipped with FeliCa Contactless IC card Technology. With RF analog part

TC35678FSG-002 TC35678FXG-002 Bluetooth® low energy IC

1. General Description 1.1. Product Concept TC35678FSG and TC35678FXG (Later omitted TC35678.) are compliant with Bluetooth® core specification 4.2. RF analog parts and baseband digital parts are built in them, and TC35678 provides Bluetooth® HCI (Host Control Interface) functions and Bluetoot

TC35678FSG-002 TC35678FXG-002 Bluetooth® low energy IC

1. General Description 1.1. Product Concept TC35678FSG and TC35678FXG (Later omitted TC35678.) are compliant with Bluetooth® core specification 4.2. RF analog parts and baseband digital parts are built in them, and TC35678 provides Bluetooth® HCI (Host Control Interface) functions and Bluetoot

TC35678FSG-002 TC35678FXG-002 Bluetooth® low energy IC

1. General Description 1.1. Product Concept TC35678FSG and TC35678FXG (Later omitted TC35678.) are compliant with Bluetooth® core specification 4.2. RF analog parts and baseband digital parts are built in them, and TC35678 provides Bluetooth® HCI (Host Control Interface) functions and Bluetoot

TC35678FSG-002 TC35678FXG-002 Bluetooth® low energy IC

1. General Description 1.1. Product Concept TC35678FSG and TC35678FXG (Later omitted TC35678.) are compliant with Bluetooth® core specification 4.2. RF analog parts and baseband digital parts are built in them, and TC35678 provides Bluetooth® HCI (Host Control Interface) functions and Bluetoot

TC35678FSG-002 TC35678FXG-002 Bluetooth® low energy IC

1. General Description 1.1. Product Concept TC35678FSG and TC35678FXG (Later omitted TC35678.) are compliant with Bluetooth® core specification 4.2. RF analog parts and baseband digital parts are built in them, and TC35678 provides Bluetooth® HCI (Host Control Interface) functions and Bluetoot

TC35678FSG-002 TC35678FXG-002 Bluetooth® low energy IC

1. General Description 1.1. Product Concept TC35678FSG and TC35678FXG (Later omitted TC35678.) are compliant with Bluetooth® core specification 4.2. RF analog parts and baseband digital parts are built in them, and TC35678 provides Bluetooth® HCI (Host Control Interface) functions and Bluetoot

TC35678FSG-002 TC35678FXG-002 Bluetooth® low energy IC

1. General Description 1.1. Product Concept TC35678FSG and TC35678FXG (Later omitted TC35678.) are compliant with Bluetooth® core specification 4.2. RF analog parts and baseband digital parts are built in them, and TC35678 provides Bluetooth® HCI (Host Control Interface) functions and Bluetoot

TC35679FSG-002 Bluetooth® low energy IC

1. General Description 1.1. Product Concept TC35679FSG (Later omitted TC35679.) is compliant with Bluetooth® core specification 4.2. RF analog parts and baseband digital parts are built in it, and TC35679 provides Bluetooth® HCI (Host Control Interface) functions and Bluetooth® low energy GATT