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TC35678FXG中文资料
TC35678FXG数据手册规格书PDF详情
1. General Description
1.1. Product Concept
TC35678FSG and TC35678FXG (Later omitted TC35678.) are compliant with Bluetooth® core specification 4.2. RF analog parts
and baseband digital parts are built in them, and TC35678 provides Bluetooth® HCI (Host Control Interface) functions and
Bluetooth® low energy GATT profile functions defined by Bluetooth® core specifications. Additionally, this IC works as an application
using low power Bluetooth® communication by storing the application program into built-in flash ROM.
1.2. Features
Compliant with Bluetooth® Ver4.2 low energy
Built-in ARM® Cortex®-M0 (13 MHz or 26 MHz operation frequency is able to select to run)
On-chip mask ROM for Bluetooth® program (384 KB)
On-chip work RAM for Bluetooth® Baseband process (192 KB)
On-chip Flash-ROM (256 KB, More than 100,000 erase and program cycles)
Supports patch program loader function
General Purpose IO (TC35678FSG 17 ports,TC35678FXG 32 ports)
General Purpose Serial Interfaces
SPI interface (1 ch assigned to a General Purpose IO)
I2C interface (1 ch assigned to a General Purpose IO)
Host CPU Interface
UART interface (9600 bps to 921.6 kbps, 2 ch - shared with GPIOs)
SPI interface
Emulator debug control interface
SWD(Serial Wire Debug)2-wire (1 ch)
Wake-up Interface (2 ch assigned to a General Purpose IO)
Wake-up input function from sleep and deep sleep
PWM Interface (4 ch assigned to General Purpose IOs)
Reference Clock Input (26 MHz)
Built-in oscillator for crystal oscillator connection
Sleep Clock Input (32.768 kHz)
External oscillator input supported
Built-in oscillator for crystal oscillator connection
Works as Standalone
Sleep and Deep Sleep Functions
Built-in DCDC converter and LDO
Wide range of input power supply voltages supported (Booting power supply voltage : 1.9 to 3.6 V, low battery voltage
detection.)
Built-in general purpose ADC
External analog inputs assigned to GPIOs (TC35678FSG-5 ch, TC35678FXG-7 ch)
Internal VDD monitoring (1 ch - connected inside)
Package:
TC35678FSG: QFN Package [40 pin, 5 x5 mm, 0.4 mm pitch, 0.9 mm thickness]
TC35678FXG: QFN Package [60 pin, 7 x7 mm, 0.4 mm pitch, 0.9 mm thickness]
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TOSHIBA |
25+ |
射频元件 |
2255 |
就找我吧!--邀您体验愉快问购元件! |
|||
TOSHIBA/东芝 |
23+ |
QFN60 |
50000 |
全新原装正品现货,支持订货 |
|||
Toshiba Semiconductor and Stor |
22+ |
60VFQFN |
9000 |
原厂渠道,现货配单 |
|||
TOSHIBA/东芝 |
2540+ |
QFN60 |
8595 |
只做原装正品假一赔十为客户做到零风险!! |
|||
TOSHIBA/东芝 |
25+ |
QFN60 |
15000 |
本公司 只做全新原装正品 |
|||
TOSHIBA |
23+ |
SOP |
5000 |
原装正品,假一罚十 |
|||
TOSHIBA |
25+ |
BGA |
37500 |
原装正品现货,价格有优势! |
|||
TOSHIBA |
25+ |
67 |
公司优势库存 热卖中! |
||||
TOSHIBA |
22+ |
PSOP |
3000 |
原装正品,支持实单 |
|||
ToshibaSe |
NA |
8560 |
一级代理 原装正品假一罚十价格优势长期供货 |
TC35678FXG 资料下载更多...
TC35678FXG 芯片相关型号
- 0679L0375-01
- 387-066-542-802
- 387-066-542-803
- 387-066-542-804
- 387-066-542-807
- 387-066-542-808
- 387-066-542-812
- 387-066-542-858
- 387-066-542-868
- 387-066-542-878
- 858-L03-203RKT1
- T4061110003-001
- T4061110003-002
- T4061110003-003
- T4061110003-004
- T4061110003-005
- TC35670FTG
- TC35670FTG-006
- TC35678FSG
- TC35678FSG-002
- TC35678FSG-002-EL
- TC35678FSG-002-ELA
- TC35678FXG-002-EL
- TC35679FSG
- TC35679FSG-002
- TC35679IFTG-002
- TC3567CFSG
- TC3567CFSG-002
- TC3567DFSG
- TC3567DFSG-002
TOSHIBA相关芯片制造商
Datasheet数据表PDF页码索引
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