1. General Description

1.1. Product Concept

TC35661SBG-009 is a 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital

part. TC35661 provides Bluetooth® HCI (Host Control Interface) function specified in Bluetooth® Core Specifications, EDR function,

and LE (Low Energy) function. Bluetooth® application is easily realized when TC35661 is connected to an external host processor

and Bluetooth® profile/stack and signal procedure are executed.

1.2. Features

 Compliant with Bluetooth® Ver4.2

 Built-in Bluetooth® baseband digital core

 Built-in Bluetooth® RF analog core

 Built-in PLL for multi-clock input

 Built-in ARM7TDMI-STM core

 On-chip Program Mask-ROM for Bluetooth® communication

 On-chip Work memory (RAM) for Bluetooth® Baseband procedure

 Supports patch program loader function

 Supports a CODEC for audio communication

 CVSD (Continuous Variable Slope Delta Modulation) CODEC

 PCM (Pulse Code Modulation) CODEC

 mSBC for WBS (Wide Band Speech)

 Connectable Serial Flash ROM/ EEPROM at external serial memory interface

 Serial Flash ROM interface (SPI)

 EEPROM interface (I2C/SPI)

 Host Interface (set for the product test.)

 UART interface: Baud rate from 2400 bps to 4.33 Mbps

 Voice/Audio CODEC Digital Interface (1-ch)

 Supports I2S (The Inter-IC Sound Bus) interface

 Left-justified interface

 Supports PCM (Pulse Code Modulation) digital interface

 General Purpose I/O (GPIO) with pull-up and pull-down resistors (MAX: 19 ports)

 Wake-up Interface

 Wake-up input function and remote wake-up output function

 Wi-Fi co-existence interface (2-wire, 3-wire and 4-wire)

 Test Interface

 JTAG Interface (ICE Interface)

 Supports OSC (Crystal oscillator: 26 MHz)

 Supports an external clock input

 Built-in oscillation circuit for an external crystal oscillator

 Supports a sleep clock

 Built-in divider for the reference operation clock

 Supports an external clock input

 Built-in sleep function

 Power Supply: Single 1.8 or 3.3 V

 Package

 P-TFBGA64-0505-0.50 [64 balls, 5x5 mm, 0.5 mm pitch, and 1.2 mm height]