74C Family Characteristics

INTRODUCTION The purpose of this 54C/74C Family Characteristics application note is to set down, in one place, all those characteristics which are common to the devices in the MM54C/MM74C logic family. The characteristics which can be considered to apply are: 1. Output voltage-current characteri

The Use of QFETs in a Flyback Converter

Introduction Power supply designers face many challenges in designing more efficient and cost-effective power supplies. Efficiency is a major consideration in designing switching power supplies. Many factors in the design process such as the input filter capacitance, transformer core geometry and

SPM??TEST BOARD for use in Isolated Inverter GND

DIP-Smart Power Module Test Board IV SPM™ TEST BOARD for use in Isolated Inverter GND (Interface using Optocouplers with Two Isolated Power Supplies)

SPM??TEST BOARD for use in Isolated Inverter GND

SPM™ TEST BOARD for use in Isolated Inverter GND (Interface using Optocouplers with Five Isolated Power Supplies)

8x8 MLP DriverMOS Packaging

INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the pac

Power33 Packaging

INTRODUCTION The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70 smaller. This packaging technology has been increasingly used for power related products due to its low package height, and excellent thermal performance for size. This is la

Dual Power56 Packaging

INTRODUCTION The Fairchild® Dual Power56 package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the pac

6x6 DriverMOS Packaging

INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the pac

Power Loss Calculation

Introduction The FDMF6704 DrMOS MCM (Multi Chip Module) product has HS and LS FETs and a gate driver all contained within a single module. The design has been optimized for Synchronous Buck applications. The switching and conduction loss of each HS FET, LS FET and gate driver are critical for sys

Smart Power Module Motion-SPM?

Mounting Guidance This application note shows the electric spacing and mounting guidance of µMini-DIP SPM.

Driving and Layout Design for Fast Switching Super-Junction MOSFETs

文件：1.92886 Mbytes Page：13 Pages

MOSFET Basics

文件：973.02 Kbytes Page：17 Pages

IGBT Basics

文件：1.0019 Mbytes Page：18 Pages

Twisted Pair FDDI Magnetics Overview and Recommendations

文件：209.6 Kbytes Page：10 Pages

Power MOSFET Avalanche Guideline

文件：377.76 Kbytes Page：7 Pages

Guidelines for Using Fairchilds Power56

文件：470.89 Kbytes Page：12 Pages

Design Guide for Selection of Bootstrap Components

文件：40.16 Kbytes Page：4 Pages

Assembly Guidelines for MicroFET 2x2 Dual Packaging

文件：560.34 Kbytes Page：5 Pages

FRFET짰 in Synchronous Rectification

文件：158.19 Kbytes Page：5 Pages

Optimized Switch for Discontinuous Current Mode Power Factor Correction

文件：438.39 Kbytes Page：8 Pages

Analysis of MOSFET Failure Modes in LLC Resonant Converter

文件：1.47849 Mbytes Page：12 Pages

Gate Resistor Design Guidelines for SupreMOS MOSFETs

文件：250.6 Kbytes Page：11 Pages

Smart Power Module Motion-SPM??Products in 關Mini-DIP SPM짰 Packages

文件：3.13107 Mbytes Page：34 Pages

Smart Power Module, Motion 1200 V SPM 2 Series

文件：3.18484 Mbytes Page：32 Pages

New SPM 2 Package Mounting Guidance

文件：392.73 Kbytes Page：2 Pages

SPM 2 Series Thermal Performance by Mounting Torque

文件：931.02 Kbytes Page：6 Pages

Motion SPM 5 Series Version 2 User?셲 Guide

文件：4.4082 Mbytes Page：28 Pages