INTRODUCTION

The Fairchild® Dual Power56 package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the package which solder directly to the printed wiring board (PWB). Modularity in package design, single and multi-die packages, is within the capability of MLP technology.