8x8 MLP DriverMOS Packaging

INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the pac

INSULATED PC SPACERS/SUPPORTS

INSULATED PC SPACERS / SUPPORTS • Board will be electrically insulated, eliminates need for insulating washers • Easy snap-in assembly • No tool required for installation • Designed for .062(1.57) thick boards • One piece design eliminates the need for additional screws and nuts • Slim desig

SAW GPS filter

Features ■ Package size 2.0 x 1.6 x 0.68 mm3 ■ Package code DCS4G ■ RoHS compatible ■ Approximate weight 0.007 g ■ Package for Surface Mount Technology (SMT) ■ Ni, gold-plated terminals ■ Electrostatic Sensitive Device (ESD) Application ■ Low-loss RF filter GPS filter ■ Usable passband:

low-loss, wide band SAW filter

文件：79.64 Kbytes Page：3 Pages

CCD image sensor High-speed operation, back-thinned FFT-CCD

文件：182.83 Kbytes Page：9 Pages