INTRODUCTION

The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70 smaller. This packaging technology has been increasingly used for power related products due to its low package height, and excellent thermal performance for size. This is largely due to the large thermal pad in the center of the package which solder directly to the printed wiring board (PWB) and allows a more direct thermal and electrical path from the drain terminal out of the package.