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XC3S200价格
参考价格：￥561.8356
型号：XC3S2000-4FG456C 品牌：Xilinx 备注：这里有XC3S200多少钱，2025年最近7天走势，今日出价，今日竞价，XC3S200批发/采购报价，XC3S200行情走势销售排行榜，XC3S200报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
XC3S200 | Spartan-3 FPGA Family | AMD 超威半导体 |   | |
Spartan-3A FPGA Family: Data Sheet Module 1: Introduction and Ordering Information DS529-1 (v2.0) August 19, 2010 • Introduction • Features • Architectural and Configuration Overview • General I/O Capabilities • Production Status • Supported Packages and Package Marking • Ordering Information Module 2: Spartan-3A FPGA | AMD 超威半导体 | | ||
Spartan-3A FPGA Family: Data Sheet Module 1: Introduction and Ordering Information DS529-1 (v2.0) August 19, 2010 • Introduction • Features • Architectural and Configuration Overview • General I/O Capabilities • Production Status • Supported Packages and Package Marking • Ordering Information Module 2: Spartan-3A FPGA | AMD 超威半导体 | | ||
Spartan-3AN FPGA Family Data Sheet Module 1: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 • Introduction • Features • Architectural Overview • Configuration Overview • In-system Flash Memory Overview • General I/O Capabilities • Supported Packages and Package Marking • Ordering Information Module 2: | AMD 超威半导体 | | ||
Spartan-3AN FPGA Family Data Sheet Module 1: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 • Introduction • Features • Architectural Overview • Configuration Overview • In-system Flash Memory Overview • General I/O Capabilities • Supported Packages and Package Marking • Ordering Information Module 2: | AMD 超威半导体 | | ||
封装/外壳：456-BBGA 包装：托盘 描述：IC FPGA 333 I/O 456FBGA 集成电路（IC） FPGA（现场可编程门阵列） | Xilinx 赛灵思 | | ||
封装/外壳：676-BGA 包装：托盘 描述：IC FPGA 489 I/O 676FCBGA 集成电路（IC） FPGA（现场可编程门阵列） | Xilinx 赛灵思 | | ||
Spartan-3A FPGA | AMD 超威半导体 | | ||
Spartan-3AN FPGA | AMD 超威半导体 | | ||
Glass Discharge Tube 文件：183.04 Kbytes Page：1 Pages | LEIDITECH 雷卯电子 | | ||
Polymer PTC Resettable Fuse 文件：647.53 Kbytes Page：16 Pages | THINKING 兴勤电子 | | ||
Tmax Molded Case Circuit Breakers 文件：3.14276 Mbytes Page：81 Pages | ABB ABB集团 | | ||
Tmax Molded Case Circuit Breakers 文件：3.14276 Mbytes Page：81 Pages | ABB ABB集团 | |
XC3S200产品属性
- 类型
描述
- 型号
XC3S200
- 制造商
XILINX
- 制造商全称
XILINX
- 功能描述
Spartan-3 FPGA
- Family
Complete Data Sheet
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
XILINX(赛灵思) |
24+ |
NA/ |
8735 |
原厂直销,现货供应,账期支持! |
|||
XILINX(赛灵思) |
23+ |
NA |
20094 |
正纳10年以上分销经验原装进口正品做服务做口碑有支持 |
|||
XILINX(赛灵思) |
24+ |
BGA |
8200 |
十年沉淀唯有原装 |
|||
XILINX |
24+ |
原厂原封 |
30000 |
原装正品公司现货,假一赔十! |
|||
XILINX |
25+23+ |
QFP144 |
4500 |
全新原装公司.柜台现货.特价热卖!绝对原装正品全新进口深圳现货
|
|||
XILINX |
21+ |
QFP |
1280 |
只做原装,质量保证 |
|||
XILINX/赛灵思 |
23+ |
TQFP100 |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
|||
XILINX |
23+ |
BGA |
10000 |
专业分销产品!绝对原装正品!全国统一服务热线:400-055-6968 更多产品,尽在毅创腾供IC网
|
|||
XILINX |
22+ |
原厂原封 |
20000 |
原装 品质保证 |
|||
XILINX |
24+ |
N/A |
8000 |
全新原装正品,现货销售 |
XC3S200规格书下载地址
XC3S200参数引脚图相关
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XC3S200数据表相关新闻
XC3S1600E-4FGG484I
优势渠道
2022-8-2XC3S200-4TQG144I
XC3S200-4TQG144I
2022-4-29XC3S200-4VQG100C
型号：XC3S200-4VQG100C 品牌：ALTERA 封装 ：QFP-100批号；21+ 优势现货库存
2021-12-28XC3S200-4FTG256C
Spartan-3E FPGA - 现场可编程门阵列 , + 125 C - 55 C FPGA - 现场可编程门阵列 , CSBGA-324 Artix-7 - 40 C FPGA - 现场可编程门阵列 , TQFP-144 FPGA - 现场可编程门阵列 , 334 I/O FPGA - 现场可编程门阵列 , 290 I/O FPGA - 现场可编程门阵列
2020-7-8XC3S1500-5FGG456C
门搜索： EQFP-144 FPGA - 现场可编程门阵列 , Spartan-3E FPGA - 现场可编程门阵列 , FBGA-676 FPGA - 现场可编程门阵列 , QFP-144 Cyclone IV E 10320 FPGA - 现场可编程门阵列 , FBGA-784 Zynq UltraScale+ MPSoC FPGA - 现场可编程门阵列 , Zynq UltraScale+ MPSoC FPG
2020-7-8XC3S1500-5FGG456C
XCZU15EG FPGA - 现场可编程门阵列 , Spartan-3E FPGA - 现场可编程门阵列 , 10 I/O FPGA - 现场可编程门阵列 , 290 I/O FPGA - 现场可编程门阵列 , XA Zynq UltraScale+ MPSoC FPGA - 现场可编程门阵列 , FBGA-484 + 70 C FPGA - 现场可编程门阵列
2020-7-8
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