Key Applications

Container-as-a-Service; Application Accelerator, Diskless HPC Clusters, All-

Flash Hyperconverged Infrastructure,

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports

the following:;

Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors;

Intel® C621A;

20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots);

2 PCIe 4.0 x16 (LP) slot; Tool-less support

Optional HW RAID Boot Controller via AOC-SMG3-2M2-B (NVMe Only)

Internal PCIe 3.0 for 2 x4 M.2 NVMe/SATA support onboard;

Network connectivity via AIOM (OCP 3.0 compliant);

6 Hot-swap 2.5 drive bays; 6 PCIe 4.0 NVMe/SAS/SATA 2.5 drives;

4 cooling fans per 2U enclosure, 16.5K RPM; Shared Cooling Design;

2600W Redundant Power Supplies Titanium Level (96%+); Shared Power

Design;

Built-in SAS3 Support via Broadcom 3808; IT Mode;