Key Applications

HPC, Cloud Gaming, MEC (Multi-Access Edge Computing), Multi-Purpose CDN,

High-availability Cache Cluster, Telco Edge Cloud, EDA (Electric Design

Automation), Mission Critical Web Applications,

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports

the following:;

Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 300W

TDP;

Intel® C741;

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-

5600;

2 AIOM;

Up to 6 Hot-swap 2.5 NVMe/SATA drives;

2x cooling fans per 2U enclosure, 16K RPM Heavy Duty; Shared Cooling

Design;

2200W Redundant Power Supplies Titanium Level (96%+); Shared Power

Design;