Key Applications

Scientific Research, Model analysis, High Performance Computing (HPC),

Research Lab, Edge AI Inferencing, Financial Services,

Key Features

Intel® Xeon® 6700 series processors, Single Socket, CPU TDP supports Up to

350W;

Support up to 4 double-width PCIe GPU accelerator cards;

Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-

8000MT/s in 16 DIMM slots;

Up to 4 PCIe 5.0 x16 FHFL double-width + 3 PCIe 5.0 x16 FHFL slots;

Up to 4 front hot-swap E1.S NVMe drive bays;

3 Redundant 2000W Titanium Level power supplies;

2U Rackmount chassis with 35.43 (900mm) depth;