Key Applications

HPC, Deep Learning/AI/Machine Learning Development, Scale-Out Object

Storage, Cloud Gaming, MEC (Multi-Access Edge Computing), Multi-Purpose

CDN, Telco Edge Cloud, IoT Edge Computing / Gateway, Cluster Node, GPU

Virtualization (VDI), HPC cluster computer nodes,

Key Features

Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports

the following:;

Single Socket BR (LGA-7529) Intel® Xeon® 6900 series processors with Pcores

up to 500W with air cooling;

Up to 12 DIMMs supporting up to 3TB MRDIMM 8800 in 1DPC;

Flexible networking with up to 2 PCIe 5.0 x16 FH AOC + 1 optional AIOM slot;

Up to 2 PCIe 5.0 x16 FH10.5L slots (1x double-width GPU or 2x single-width

AOCs);

GrandTwin front IO module offers additional value for networking

expansion(10G/25G/200G).;

2 Redundant 2200W Titanium (certification pending) Level power supplies;