Key Applications

HPC, Cloud Gaming, MEC (Multi-Access Edge Computing), Multi-Purpose CDN,

High-availability Cache Cluster, Telco Edge Cloud, EDA (Electric Design

Automation), Mission Critical Web Applications,

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports

the following:;

Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 350W

TDP;

Intel® C741;

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-

5600;

Optional AIOM module or internal PCIe 5.0 x16;

Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x

25GbE;

Two optional storage modules. Each module supports 2x NVMe or SATA

drive bays;

2200W Redundant Power Supplies Titanium Level (96%+); Shared Power

Design;