Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

The Stacked CSP family leverages Amkor’s industry-leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities.

FEATURES 2-21 mm body size Package height down to 0.5 mm High die count pure memory, eMMC, eMCP and MCP Design, assembly and test capabilities that enable stacking of DRAM with logic or flash memory devices Logic/Flash, digital/analog and other ASIC/memory combinations of 320 I/O and gre

FAST RECOVERY HIGH CURRENT DOUBLER AND CENTER TAPS

文件：67.85 Kbytes Page：2 Pages

封装/外壳：模块 包装：散装 描述：DIODE FAST 400V 60A 分立半导体产品 二极管 - 整流器 - 阵列

High Current, High Density, Standard Recovery Doubler and Center Taps

High Current, High Density, Fast Recovery Doubler and Center Taps

SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS

文件：71.73 Kbytes Page：2 Pages

SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS

文件：71.73 Kbytes Page：2 Pages

封装/外壳：模块 包装：散装 描述：DIODE FAST 100V 75A 分立半导体产品 二极管 - 整流器 - 阵列

High Current, High Density, Fast Recovery Doubler and Center Taps

SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS

文件：71.73 Kbytes Page：2 Pages

STANDARD RECOVERY HIGH CURRENT DOUBLER AND CENTER TAPS

文件：68.8 Kbytes Page：2 Pages